Method for quickly generating PCIe UVM verification platform
A verification platform and fast technology, applied in the fields of instrumentation, error detection/correction, calculation, etc., can solve problems such as hindering the progress of chip verification, low efficiency, and difficulty in building a chip verification platform, so as to improve efficiency and reduce the probability of errors. Effect
Pending Publication Date: 2022-06-10
芯河半导体科技(无锡)有限公司
View PDF0 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Most of the verification platforms are built based on the UVM verification methodology. With the increase of the chip scale, it becomes more and more difficult to build the chip verification platform. The traditional PCIe UVM verification platform is manually written code, resulting in The efficiency is very low, which seriously hinders the progress of chip verification
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0050] cfg folder: what is stored under this folder is the configuration information of the entire verification platform, such as register addresses and the like.
[0051] Duv folder: what is stored under this folder is all the filelist list information of the entire verification platform.
[0053] SVA folder: This folder is used to store the SVA of the entire verification platform.
[0055] Testcase folder: this folder is used to store the testcase required for verification, and here is a generated
[0062] The reference model and result comparison module (scoreboard) are also integral parts of the chip verification platform. Book
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
According to the method for rapidly generating the PCIe UVM verification platform, the Perl script is used for constructing the universal framework of the PCIe UVM verification platform, and the framework of the PCIe UVM verification platform can be generated only by inputting the unique part of the verification platform according to the prompt in the using process, so that the efficiency of constructing the verification platform can be greatly improved; and the probability of errors in the process of establishing the verification platform can be greatly reduced.
Description
A Method to Quickly Generate PCIe UVM Verification Platform technical field [0001] The present invention relates to the technical field of IC verification, in particular to a method for rapidly generating a PCIe UVM verification platform. Background technique In recent years, my country's integrated circuit (IC) industry has developed rapidly, and the functions realized by chips have become more and more powerful. The size of the film grew rapidly. The verification of digital integrated circuits is the key technology to improve the success of first-time tape-out of design chips. With the refinement of the chip manufacturing process, the manufacturing cost of the chip is also increasing, facing the increasingly complex chip system With the highly integrated approach of design and IP, the importance of chip verification is also increasing. [0003] PCIe (peripheral component interconnect express) is different from the previous IO bus. Use a serial, point-to-point inte...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/273G06F13/42
CPCG06F11/273G06F13/4221
Inventor 杨爱丽
Owner 芯河半导体科技(无锡)有限公司