Multi-chip packaging structure and manufacturing method thereof
A technology of multi-chip packaging and manufacturing method, which is applied in the direction of semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., to achieve the effects of improving heat dissipation efficiency, improving stability, and suppressing thermal crosstalk.
Active Publication Date: 2022-06-10
山东中清智能科技股份有限公司
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Problems solved by technology
However, the existing heat sink is usually a plate structure, and the heat generated by each semiconductor chip cannot be quickly dissipated due to poor contact between the heat sink and each heat dissipation adhesive layer.
Method used
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Embodiment Construction
[0020] see Figure 1-Figure 4 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of the present invention, so that only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and the component layout type may also be more complicated.
[0021] like Figure 1-Figure 4 As shown, the present invention also proposes a method for manufacturing a multi-chip packaging structure, comprising the following steps:
[0022] In a specific embodiment, the first chip 201 , the second chip 202 , the third chip 203 , and the fourth chip 204 may be chips with the same function or chips with different functions. Further, the heat production of the first chip 201, the second chip 202, the third chip 203, and the fourth chip 204 are different. In ...
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The invention relates to a multi-chip packaging structure and a manufacturing method thereof, and relates to the field of semiconductor packaging, by optimizing the structure of a heat dissipation plate, each heat dissipation block can move independently, then it can be ensured that each heat dissipation area of the heat dissipation plate is in close contact with heat dissipation glue layers on the surfaces of different chips, the heat dissipation efficiency is improved, and the service life of the heat dissipation plate is prolonged. And meanwhile, a thermal resistance area is arranged at the periphery of each heat dissipation area, so that heat generated by different chips is prevented from being transversely transferred, and a thermal crosstalk phenomenon among the chips is further inhibited. Meanwhile, supporting pieces are arranged between the chips, and the supporting pieces are used for abutting against the first thermal resistance area, the second thermal resistance area, the third thermal resistance area and the fourth thermal resistance area, so that the stability of the heat dissipation plate is improved, and the probability that the connecting wires are damaged due to excessive movement of the resin blocks is reduced.
Description
technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a multi-chip packaging structure and a manufacturing method thereof. Background technique [0002] In the manufacturing process of the existing multi-chip packaging structure, usually a conductive base is provided first, and then a plurality of semiconductor chips are arranged on the conductive base, and then a heat dissipation adhesive layer is respectively arranged on the plurality of semiconductor chips, and then A heat dissipation element is arranged on the conductive base, and the heat dissipation element is thermally connected to each semiconductor chip through each heat dissipation adhesive layer. However, the existing heat sink is usually a plate structure, and the heat generated by each semiconductor chip cannot be quickly dissipated due to poor contact between the heat sink and each heat dissipation adhesive layer. Contents of the invention [0003] The object ...
Claims
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IPC IPC(8): H01L23/367H01L23/14H01L23/16H01L25/065H01L21/50
CPCH01L23/367H01L23/14H01L23/16H01L25/0655H01L25/50
Inventor 陈国栋
Owner 山东中清智能科技股份有限公司