Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Packaging device and manufacturing method thereof

A technology for packaging devices and plastic bodies, which is used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., and can solve problems such as uneven thickness of electromagnetic shielding layers

Active Publication Date: 2022-06-21
NINGBO CHIPEX SEMICON
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] This application proposes a packaged device and a method for manufacturing the packaged device, which can at least solve the technical problem of uneven thickness of the electromagnetic shielding layer of the existing packaged device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging device and manufacturing method thereof
  • Packaging device and manufacturing method thereof
  • Packaging device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] In a possible implementation method, at least one angle value corresponding to the side of the plastic seal side is greater than or equal to 40 °, and the angle value of the angle corresponding to at least one plastic seal side is less than or equal to 70 °.

[0029] In the embodiment of this instructions, when the angle value (angle value of the sharp angle) of at least one plastic seal side is ≤70 °, the shielding layer sputtering process is performed on this parameter to obtain a more uniform shielding layer on this parameter to obtain a more uniform shielding layer.30.

[0030] In a possible implementation method, the projection of the plastic seal 40 along the target direction is located on the first side of the substrate 10, and the target direction is perpendicular to the substrate 10.

[0031] In the embodiment of this instructions, the length of the projection area of the 40s of the plastic seal can be smaller than the length of the substrate 10, the width correspond...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a packaging device and a manufacturing method of the packaging device. The package device includes: a substrate; the chip is arranged on the first side surface of the substrate; the chip is covered with the plastic package body, the plastic package body is provided with a plurality of plastic package side faces and a plastic package top face, the first ends of the plastic package side faces are connected with the first side face of the substrate, the second ends of the plastic package side faces are connected with the plastic package top face, and the included angle between at least one plastic package side face and the first side face of the substrate is an acute plastic package side face; and the shielding layer is arranged on the first side surface of the substrate, the shielding layer is arranged outside the plastic package body in a covering manner, and the shielding layer is attached to the plastic package side surface and the plastic package top surface. The included angle between at least one plastic package side face of the plastic package body and the first side face of the substrate is an acute angle, at a proper sputtering angle, the plastic package side face corresponding to the acute angle is subjected to rebound sputtering from the substrate, the plastic package top face and other plastic package side faces are subjected to direct sputtering, and the plastic package top face and the multiple plastic package side faces are subjected to sputtering at the same time. Therefore, the thickness of the shielding layer is uniform.

Description

Technical field [0001] The present invention involves the field of semiconductor packaging packaging technology, which specifically involves a production method for packaging devices and packaging devices. Background technique [0002] The effect of electromagnetic shielding is to cut off the transmission path of electromagnetic waves to eliminate interference.Products that are packaged with a grid packaging technology (Land Grid Array (LGA), the thickness uniformity of the electromagnetic shielding layer is poor, which affects the shielding effect of electromagnetic shielding. Invention content [0003] This application proposes a method of making packaging devices and packaging devices, which can at least solve the technical problems of uneven thickness of the electromagnetic shielding layer of the existing packaging device. [0004] According to one aspect of this application, a packaging device is provided, including: Substrate; Chip, the chip is set on the first side of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L21/48
CPCH01L23/552H01L21/4814
Inventor 汪洋李春阳高局方梁洪
Owner NINGBO CHIPEX SEMICON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com