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Manufacturing method of display module and display module

A production method and display module technology are applied in the production of display modules and in the field of display modules, which can solve the problems of display screen blur, chip dead light, poor user sense of use, etc., so as to ensure normal use, prevent blur screen phenomenon, Improve the effect of the user experience

Pending Publication Date: 2022-06-21
SHENZHEN ABSEN OPTOELECTRONIC CO LTD
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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that in the display module of the prior art, the inkjet will cause the ink to cover the chip, resulting in the phenomenon of chip dead light, dim light, etc., thereby affecting the brightness of the display screen, causing the display screen to produce a blurred screen phenomenon, and the user's sense of use. poor technical issues

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  • Manufacturing method of display module and display module
  • Manufacturing method of display module and display module

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Embodiment Construction

[0019] Exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and the descriptions and drawings therein are essentially used for illustration rather than limitation this invention.

[0020] In the description of the present application, it should be understood that, in the embodiments shown in the accompanying drawings, indications of directions or positional relationships (such as up, down, left, right, front and back, etc.) are only for the convenience of describing the present application and to simplify the description, rather than to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation. These descriptions are appropriate when the elem...

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Abstract

The invention provides a manufacturing method of a display module and the display module, the manufacturing method comprises the steps of preprocessing, die bonding, inking, reprocessing and packaging, and the display module comprises a substrate, a plurality of chips, an inking layer and a packaging layer. In the manufacturing method of the display module and the display module, a chip is subjected to surface treatment before being fixed with a substrate, so that a protective layer is formed on the surface of the chip. After the inking layer is formed on the chip and the substrate, the protection layer can form isolation between the chip and the inking layer. By removing the protective layer, the protective layer on the chip can be removed accordingly, so that the chip is prevented from being covered by the inking layer, normal use of the chip is guaranteed, the conditions of dead light and dark light of the chip are avoided, the blurred screen phenomenon of the display module is prevented, the display brightness of the display module and the yield of the display module are guaranteed, and the display quality of the display module is improved. Therefore, the use experience of the user is effectively improved.

Description

technical field [0001] The present invention relates to the technical field of display devices, and in particular, to a manufacturing method of a display module and a display module. Background technique [0002] Light-emitting diodes (LEDs) are widely used in lighting and display fields due to their advantages of high brightness, long life, fast response and environmental protection. In recent years, the combination of semiconductor micro-nano manufacturing technology and LED technology has led to the rapid development of LED display technology in the direction of micro display and high resolution. Mini LED has many excellent characteristics, such as higher brightness, resolution and color saturation. , lower energy consumption, longer life and faster response speed, with broad application prospects. [0003] At present, mini LED usually adopts the bottom inkjet method to improve the contrast of the product. However, inkjet will cause ink to cover the chip, resulting in t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/54G09F9/33
CPCH01L25/0753H01L33/54G09F9/33H01L2933/005
Inventor 许文捷欧阳琴丁崇彬
Owner SHENZHEN ABSEN OPTOELECTRONIC CO LTD
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