Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board assembly processing system

A technology of circuit board components and processing systems, applied in the direction of electrical components, electrical components, etc., can solve problems such as misjudgment or missed judgment, and achieve the effect of improving detection accuracy

Pending Publication Date: 2022-06-21
HONGFUJIN PRECISION ELECTRONICSCHONGQINGCO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing SMT production lines generally require one person to maintain one SMT production line. AOI testing equipment relies on template comparison algorithms to detect the soldering of circuit board components, and there may be misjudgments or missed judgments.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board assembly processing system
  • Circuit board assembly processing system
  • Circuit board assembly processing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0023] It is further to be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements , but also other elements not expressly listed or inherent to such a process, method, article or apparatus. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The circuit board assembly processing system comprises reflow soldering equipment, detection equipment, first board receiving equipment, second board receiving equipment, cache equipment, corner equipment and computer equipment. And the cache equipment is used for temporarily storing the circuit board assembly welded by the reflow soldering equipment and transmitting the circuit board assembly to the detection equipment for detection. And the turning equipment is used for transferring the circuit board assembly to the first board collecting equipment when the circuit board assembly is judged to be a good product, and transferring the circuit board assembly to the second board collecting equipment when the circuit board assembly is judged to be a defective product. And the computer equipment is in communication connection with the detection equipment and is used for displaying the detection information of the circuit board assembly which is judged to be defective by the detection equipment so as to re-judge whether the circuit board assembly is a defective product or not. According to the invention, the detection accuracy of the processing defects of the circuit board assembly can be improved.

Description

technical field [0001] The present invention relates to the field of Surface Mount Technology (SMT), in particular to a circuit board assembly processing system. Background technique [0002] SMT is a new generation of electronic assembly technology developed from hybrid integrated circuit technology. It is characterized by the use of component surface mount technology and reflow soldering technology, and has become a new generation of assembly technology in electronic product manufacturing. The SMT production line mainly includes printing machines, placement machines, reflow soldering equipment, automatic optical inspection (Automatic Optic Inspection, AOI) equipment and so on. In the existing SMT production line, one person generally maintains one SMT production line. The AOI inspection equipment relies on the template comparison algorithm to detect the welding condition of the circuit board components, and there may be misjudgments or missed judgments. SUMMARY OF THE IN...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/08
CPCH05K13/0817
Inventor 肖科邓建武贺泽林张中煌王波田光丽向康宁贺茂华张志广
Owner HONGFUJIN PRECISION ELECTRONICSCHONGQINGCO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com