Integrated insulation board production board composite bonding device and method

Abstract

The invention relates to the field of composite insulation board production, in particular to an integrated insulation board production board composite bonding device and method.The integrated insulation board production board composite bonding device comprises a ground table, a butt joint part and a spraying piece, the butt joint part can achieve direct butt joint of single-layer insulation boards and can also conduct scraping treatment on binders overflowing from the bonding positions of the composite insulation boards, and the spraying piece can conduct spraying on the composite insulation boards; on the basis, the quality of the finally bonded and formed composite insulation board is greatly improved, meanwhile, the overall spraying range of the designed spraying head can be adjusted and increased according to the longitudinal size of the single-layer insulation board, and the purpose of the design is to avoid the situation that a binder is not sprayed comprehensively, so that the spraying efficiency is improved. And meanwhile, the situation that too much waste is caused due to the fact that the spraying range of the binding agent is too large is avoided.

Description

technical field [0001] The invention relates to the field of production of composite thermal insulation boards, in particular to a composite bonding device and method for producing integrated thermal insulation boards. Background technique [0002] The thermal insulation board is a rigid foam board made of polystyrene resin as raw material plus other raw and auxiliary materials and polymeric substances, heated and mixed at the same time, injected with catalyst, and then extruded and formed. [0003] The insulation board can be used alone, or multiple insulation boards can be used as a whole by bonding with adhesives. Before the insulation boards are bonded, it is necessary to ensure that the insulation boards are connected to each other. If there is a deviation between the positions of the thermal insulation boards, the quality of the bonded composite thermal insulation boards will be reduced, and at the same time, there will be excess adhesive overflow at the joints of the ...

AI Technical Summary

Problems solved by technology

[0003] The insulation board can be used alone, or multiple insulation boards can be used as a whole by bonding with an adhesive. Before the insulation boards are bonded, it is necessary to ensure that the insulation boards are connected. If there is a deviation in the position between the insulation boards, the quality of the bonded composite insulation board will be reduced, and at the same time, excess adhesive will overflow at the joint of the formed composite insulation board. In the case of the adhesive, it is easier to form adhesive scabs at the joints of the composite insulation board, which will affect the appearance quality of the composite insulation board

[0004] In addition, in the case of changes in the size of the insulation board, it is difficult to make corresponding changes in the spraying range of the adhesive, which will lead to some problems. For example, if the spraying range of the adhesive is small, it will If the spraying is not comprehensive, the bonding degree between the insulation boards will be reduced, and the spraying range of the adhesive is large, which will cause too much waste of the adhesive

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