Semi-automatic BGA packaging test socket

Abstract

The invention relates to the field of electrical variable measurement, in particular to a semi-automatic BGA (Ball Grid Array) packaging test socket, which comprises a base, a supporting part, at least two first pressing mechanisms, at least two second pressing mechanisms, a connecting piece and a driving mechanism. According to the packaging device, the driving mechanism drives the first pressing mechanism and the second pressing mechanism to be close to the packages, and the packages with different sizes are fixed to the center of the containing space under the action of the connecting piece. Due to the fact that the pushing inclined faces are located on the faces, facing the packages, of the extrusion blocks, the first pressing mechanism and the second pressing mechanism can apply equal pressing force to the packages with different thicknesses, and the pressing force is evenly distributed on the packages. Excessive wear is avoided while the test accuracy is ensured. A plurality of test sockets do not need to be prepared according to different packaging sizes, the test sockets do not need to be replaced frequently in the test process, the test efficiency is improved, and the test cost is reduced.

Description

technical field [0001] The invention relates to the field of measuring electrical variables, in particular to a semi-automatic BGA package test socket. Background technique [0002] Since impurities in the air will corrode the chip circuit and reduce the electrical performance of the chip, the chip needs to be isolated from the outside world. People process semiconductor components into chip packages through a series of packaging projects, and the packaged chips are also easier to install. and transportation. The processed package needs to use a test tool to check the electrical characteristics of the semiconductor chip package before it is provided to the user. The test socket is often used in the process of checking the electrical characteristics. The measurement socket is a kind of inspection for manufacturing defects and defective components. Standard equipment for testing electrical variables, test sockets are mainly used to measure the electrical performance and elect...

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a semi-automatic BGA package test socket to solve the problem that the existing package test socket cannot give BGA packages with different sizes uniform and constant pressure, resulting in error The problem of high judgment rate or excessive wear, as well as the problem of low test efficiency and high cost caused by preparing different test sockets according to package size and frequent replacement of test sockets during the test process

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