Computer cooling system adopting uniform distribution structure

Abstract

The invention belongs to the technical field of computer heat dissipation, and discloses a computer heat dissipation system adopting a uniform distribution structure, the computer heat dissipation system comprises a base, a mainframe box is fixedly mounted at the top of the base, first air outlet holes are formed in the top and the front surface of the mainframe box, and an air box is fixedly mounted at the bottom end in the mainframe box. By arranging the first air outlet hole, the air box and the bent pipe, air entering the air box is divided into two parts through operation of the draught fan, one part is used for cooling a display card and a processor in the mainframe box, and the other part is used for cooling high-temperature air through the bent pipe; according to the air box, the temperature of the air is reduced and is uniformly dissipated through the first air outlet holes, so that the heat dissipation speed of the temperature of the air exhausted to the outside of the air box is higher, the initial value of the air temperature of the air entering the air box is always in a lower interval, heat in the air box is conveniently dissipated, and the heat dissipation effect is improved.

Description

technical field [0001] The invention belongs to the technical field of computer heat dissipation, in particular to a computer heat dissipation system adopting a uniform structure. Background technique [0002] With the continuous development of science and technology, computers are an indispensable electronic product in our daily life and work. A large number of integrated circuits are used in computer components. As we all know, the heat that causes high temperature does not come from outside the computer, but inside the computer, or integrated circuits. Inside the circuit, most radiators absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distance through various methods, such as the air in the chassis, and then the chassis transmits the hot air to the outside of the chassis to complete the cooling of the computer. . [0003] At present, most of the general computer mainframes use cooling fans and heatsinks to dissipate...

AI Technical Summary

Problems solved by technology

[0003] At present, most of the general computer mainframes use cooling fans and heat sinks to dissipate heat from the processor and graphics card on the mainboard. The mainframe will be provided with air holes for air flow, and the cooling fans will draw in the outside air to make the outside cool. The air replaces the hot air inside the main box, and then discharges the hot air through the cooling holes. After a long time of operation, the temperature of the air around the main box rises. Diffusion is sucked into the air inlet, which makes the initial temperature entering the main chassis gradually increase, which in turn leads to a gradual decrease in the heat dissipation effect inside the main chassis, which in turn causes the internal temperature to be too high and cause damage to internal components

[0004] When the general main box is cooling the internal processor and graphics card, in order to prevent the dust in the outside air from entering the main box, a filter is usually installed at the air inlet to filter the dust in the air. After a long time of filtering operation, a large amount of dust will adhere to the surface of the filter screen, which will reduce the air intake per unit time of the air inlet, and the heat inside the main unit cannot be fully taken out and cooled, resulting in a gradual increase in the temperature inside the main unit box

[0005] Generally, in order to enhance the heat dissipation effect inside the main chassis, a built-in water tank is usually used, so that the incoming air can be cooled first, and then the processor and graphics card inside the main chassis can be cooled. Icing occurred, causing the internal ventilation ducts to rupture, which caused inconvenience to the staff, so it needs to be improved and optimized

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