Vacuum packaging system for integrated circuit board

An integrated circuit board, vacuum packaging technology, applied in circuits, electrical components, devices for coating liquids on surfaces, etc., can solve problems such as reducing overall efficiency, occurrence of defective products, and long curing time

Inactive Publication Date: 2022-06-28
ZIBO VOCATIONAL INST
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. In the plastic sealing process, it is easy to mix air bubbles, resulting in defective products in the

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vacuum packaging system for integrated circuit board
  • Vacuum packaging system for integrated circuit board
  • Vacuum packaging system for integrated circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to more clearly and clearly illustrate the specific implementation purpose and implementation manner of the present invention, the technical solutions of the present invention will be fully described below, and the described embodiments are a part of the embodiments of the present invention, rather than all the embodiments. On the premise that no creative work is made, all other embodiments based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0047] The integrated circuit board vacuum packaging system of the present invention, such as figure 1 As shown, it includes: a cabinet body 10 arranged on the ground for built-in electrical control components, the upper end of the cabinet body 10 is sealed with a cover body 20, and the lower bottom of the cover body 20 is configured as an inward concave shape, which is fixed inside. And a translation mechanism 30 is accommodated.

[0048] like figure 2 A...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to an integrated circuit board vacuum packaging system which comprises a cabinet body and a cover body which are connected in a sealed mode, and a translation mechanism is arranged between the cabinet body and the cover body. A vacuum unit and an electric control part are arranged in the cabinet body; the translation mechanism comprises a driving mechanism, a longitudinal movement mechanism and a transverse movement mechanism which are adjacently and slidably connected; the longitudinal moving mechanism comprises a longitudinal moving plate, a longitudinal moving synchronous wheel set, an upper sliding block and a lower sliding block; the transverse moving mechanism comprises a transverse moving rod, a lower sliding rail, a transverse moving synchronous wheel, a spiral pipe, a fixing plate, a glue injection needle and a synchronous belt; the driving mechanism comprises a foundation rod, an upper sliding rail, a driving synchronizing wheel and a driving motor. According to the vacuum packaging system for the integrated circuit board, vacuum plastic packaging and curing are achieved, the yield is increased, and the curing time is shortened.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a vacuum packaging system for an integrated circuit board. Background technique [0002] An integrated circuit is a miniature electronic device or component. Using semiconductor manufacturing processes such as oxidation, lithography, diffusion, epitaxy, and aluminum evaporation, components and wirings such as transistors, resistors, capacitors, and inductors required in a circuit are interconnected and fabricated on a small or several small semiconductor wafers. or dielectric substrate, and then solder the electronic device packaged in a package. [0003] The integrated circuit package not only plays the role of electrical connection between the bonding point in the integrated circuit chip and the outside, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a role in mechanical or environmental protection for the integrated ci...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67H01L21/56B05C5/02B05C15/00B05C11/10
CPCH01L21/67121H01L21/56B05C5/0208B05C15/00B05C11/1002
Inventor 张振远
Owner ZIBO VOCATIONAL INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap