Multi-axis sheet feeding system for semiconductor equipment

Abstract

The invention discloses a multi-shaft wafer feeding system for semiconductor equipment, which comprises a first driving assembly, a first lifting assembly and a multi-shaft wafer feeding unit consisting of an outer boat assembly, an inner boat assembly, a thermocouple assembly and a boat frame assembly, and is characterized in that the first driving assembly drives the first lifting assembly to drive the multi-shaft wafer feeding unit to lift in a reciprocating manner; the outer boat assembly comprises a second driving assembly and an outer boat frame connecting rod, the inner boat assembly comprises a third driving assembly and an inner boat frame connecting rod, the thermocouple assembly comprises a thermocouple and a fourth driving assembly, and the thermocouple, the inner boat frame connecting rod and the outer boat frame connecting rod are sequentially installed in a nested mode. The third driving component drives the inner boat frame connecting rod to lift and move the boat frame component loaded with the substrate into or out of the growth mother solution; the second driving assembly drives the outer boat frame connecting rod to rotate and drives the boat frame assembly to rotate, so that substrate coating is completed; and the fourth driving assembly drives the thermocouple to lift so as to test the temperature of different parts of the reaction chamber. The method has the advantages of simple operation, high control precision, flexible and changeable temperature measurement points and the like.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a multi-axis sheet feeding system for semiconductor equipment. Background technique [0002] With the rapid development of the semiconductor industry and the blockade of our technology by European and American countries, it is more urgent for the country to develop semiconductor equipment technology. The core of the semiconductor equipment motion system is the dynamic measurement of substrate transportation and reaction chamber process temperature. Most of the substrate transportation of existing semiconductor equipment is a simple uniaxial mechanism, that is, the substrate is directly transferred to the process chamber in a straight line, and the temperature measurement point on the substrate is fixed, so it is impossible to detect real-time detection of different positions within the constant temperature zone of the reaction chamber. process temperature. Th...

AI Technical Summary

Problems solved by technology

Obviously, the existing single-substrate boat mechanism with a fixed temperature measurement point can only meet the preparation of ordinary semiconductor materials, but cannot meet the preparation conditions of high-quality or special semiconductor materials.

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