Material selection method for metal bonding structure with low interface stress and anti-fatigue design
A technology of interface stress and metal glue, which is applied in the field of nuclear accident simulation, can solve the problems that the interface fatigue debonding is not fully considered, and the fatigue debonding of the metal bonded structure cannot be fundamentally improved, so as to achieve the design of low interface stress Effect
Pending Publication Date: 2022-07-12
CHINA HELICOPTER RES & DEV INST
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[0006] Purpose of the present invention: In order to solve the above-mentioned technical problems, the embodiment of the present invention provides a material selection method for a metal bonded structure with a low interface stress and anti-fatigue design, so as to solve the existing solution to the problem of interface debonding of the metal bonded structure , because the other key influencing factors of interface fatigue debonding in the metal bonding structure are not fully considered, the existing technical solutions cannot fundamentally improve the problem of fatigue debonding in the metal bonding structure
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[0061] In order to make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, the embodiments in the present application and the features in the embodiments may be arbitrarily combined with each other if there is no conflict.
[0062] It has been explained in the above-mentioned background art that for the interface debonding problem of metal bonding structure, the main idea of the existing solution is to select an adhesive or a bonded material with the highest possible bonding strength in the process of structural design and material selection, and screen out The strongest combination of materials. However, the above-mentioned existing solutions for the interfacial debonding of metal-bonded structures do not fully consider the key influencing factors of interfacial fatigue debonding of metal-bonded st...
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The embodiment of the invention discloses a material selection method for a metal glue joint structure with low interface stress and anti-fatigue design, which comprises the following steps: determining influence factors of fatigue debonding of the metal glue joint structure and a material selection basic principle of the anti-fatigue design of the metal glue joint structure according to a failure form of the metal glue joint structure; taking a metal bonding interface of the metal bonding structure as an object, and obtaining an interface stress coefficient and a material selection criterion of low interface stress design of the metal bonding structure; and the interface stress coefficient f is applied to the material selection process of the metal glue joint structure, and a material selection strategy of the metal glue joint structure with low interface stress and anti-fatigue design is established. According to the technical scheme provided by the embodiment of the invention, the problem of interface debonding of the metal bonding structure is solved, and other key influence factors of interface fatigue debonding of the metal bonding structure are not comprehensively considered; therefore, the problem of fatigue debonding of the metal bonding structure cannot be fundamentally solved in the prior art.
Description
technical field [0001] The present application relates to, but is not limited to, the technical field of nuclear accident simulation, and more particularly, to a material selection method for metal bonding structures with low interface stress and anti-fatigue design. Background technique [0002] Metal bonded structures are widely used in helicopter primary and secondary load-bearing structures. like figure 1 As shown, it is a schematic diagram of a practical application structure of the existing metal bonding structure, figure 1 The aluminum alloy panel-honeycomb core material (aluminum core material or paper core material) glued assembly structure shown in is the main component structure of the helicopter equipment cabin floor, the fuselage cabin floor, the special cabin equipment installation board, etc. quality, high specific strength, sound insulation, heat insulation, moisture resistance and good sealing; such as figure 2 As shown, it is a schematic diagram of anot...
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IPC IPC(8): G06F30/17G06F30/23G06F111/10G06F119/02G06F119/14
CPCG06F30/17G06F30/23G06F2111/10G06F2119/02G06F2119/14Y02T90/00
Inventor 温学何志平刘文琦徐朝梁
Owner CHINA HELICOPTER RES & DEV INST
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