Material selection method for metal bonding structure with low interface stress and anti-fatigue design
A technology of interface stress and metal glue, which is applied in the field of nuclear accident simulation, can solve the problems that the interface fatigue debonding is not fully considered, and the fatigue debonding of the metal bonded structure cannot be fundamentally improved, so as to achieve the design of low interface stress Effect
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[0061] In order to make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, the embodiments in the present application and the features in the embodiments may be arbitrarily combined with each other if there is no conflict.
[0062] It has been explained in the above-mentioned background art that for the interface debonding problem of metal bonding structure, the main idea of the existing solution is to select an adhesive or a bonded material with the highest possible bonding strength in the process of structural design and material selection, and screen out The strongest combination of materials. However, the above-mentioned existing solutions for the interfacial debonding of metal-bonded structures do not fully consider the key influencing factors of interfacial fatigue debonding of metal-bonded st...
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