Pretreatment method for near-field kinetic model containing three-dimensional initial crack surface
A dynamic model and initial crack technology, applied in image data processing, electrical digital data processing, 3D modeling, etc., can solve problems such as lack of characterization means
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0069] The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
[0070] The present invention provides a preprocessing method for a peri-dynamic model containing a three-dimensional initial crack surface, and the specific implementation steps are as follows:
[0071] (1) Discrete the calculation model into a series of nodes with material physical and mechanical information, and store the coordinates, volume and other information of the nodes separately.
[0072] (2) Determine the radius δ of the node support domain (usually three times the node spacing), and search for other node information within the node support domain. For this step, it can be calculated by the kdtree / rangesearch function of the binary tree algorithm.
[0073] (3) Determine the spatial coordinates of the bounded plane representing the three-dimensional crack; for complex three-dimensional cracks, it can be divided into several plane t...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com