Separated radiator for 5G communication

Abstract

The invention relates to the technical field of cooling fins, and discloses a separated radiator for 5G communication, which comprises cooling fins, the cooling fins are composed of a main cooling fin and an auxiliary cooling fin, the main cooling fin is provided with a groove, the auxiliary cooling fin is fixedly mounted in the groove, a gap is formed between the periphery of the auxiliary cooling fin and the main cooling fin, the groove is provided with a through hole, and the through hole is communicated with the main cooling fin. Bosses are arranged at the bottoms of the auxiliary cooling fins and can be tightly attached to components to be isolated through the through holes, and heat insulation sheets are arranged between the main cooling fins and the auxiliary cooling fins. According to the separated radiator for 5G communication, the mutual influence of heat dissipation heat among heating components can be reduced, the normal working temperature of the components which have high requirements for the environment temperature or are sensitive to heat is effectively guaranteed, the structural form of the heat dissipation structure cannot be obviously changed, the design cost of the heat dissipation structure is prevented from being increased, and the service life of the heat dissipation structure is prolonged. And a high-heat-conductivity material and complicated processing are not needed, so that the production cost is controlled.

Description

technical field [0001] The invention relates to the technical field of heat sinks, in particular to a separate heat sink for 5G communication. Background technique [0002] In communication equipment, in order to better dustproof and waterproof, the casing is in a sealed state. Each electronic component is usually dissipated by heat sinks. Each component inside the casing is in the same or similar temperature environment. The heat dissipated between them affects each other. [0003] When the communication equipment includes components with high environmental temperature requirements or heat-sensitive components, it is often difficult to ensure the normal working temperature of the components due to the great influence of other heating components in the casing. The usual solution is to use this component. For the heat-resistant model of the component itself, if the component selection cannot meet the requirements, the auxiliary heat dissipation method is used to improve the ...

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Problems solved by technology

[0004] At present, conventional auxiliary heat dissipation methods include: material selection (high thermal conductivity materials), heat pipes, surface spraying, reduction of contact thermal resistance, etc. In the case of high volume and weight requirements for communication equipment, the heat dissipation effect of the above auxiliary heat dissipation methods is limited. , and will obviously increase the design cost or production cost

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