Quick-positioning low-shrinkage UV moisture dual-curing polyurethane hot melt adhesive and preparation method thereof

A polyurethane hot-melt adhesive and dual-cure technology, which is applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of poor wettability of substrates and poor flexibility of products, and achieve good flexibility , Improving impact resistance, high degree of molecular adjustment

Active Publication Date: 2022-07-22
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Conventional polyurethane hot melt adhesives are prone to crystallization shrinkage during cooling and crystallization. If the content of crystallization components is too high, the shrinkage will be too significant, resulting in poor wettability of the adhesive layer to the substrate and poor flexibility of the product.

Method used

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  • Quick-positioning low-shrinkage UV moisture dual-curing polyurethane hot melt adhesive and preparation method thereof
  • Quick-positioning low-shrinkage UV moisture dual-curing polyurethane hot melt adhesive and preparation method thereof
  • Quick-positioning low-shrinkage UV moisture dual-curing polyurethane hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A fast-positioning low-shrinkage UV moisture dual-curing polyurethane hot-melt adhesive, comprising the following raw materials:

[0048]

[0049] In the present embodiment, the described preparation method is as follows:

[0050](1) 25 parts of self-made difunctional diols, 21 parts of polyethylene adipate, 15 parts of polyethylene terephthalate, and two parts of polyadipate-hexanediol-neopentyl glycol 18 parts of alcohol, mixed evenly, vacuumed and dehydrated at 120-125 ℃ for 2 hours, the vacuum degree is guaranteed to be ≤-0.098MPa, and the measured water content is ≤100ppm, and the next step is carried out.

[0051] (2) The mixed polyol was cooled to 80-85°C, 18 parts of diphenylmethane diisocyanate were added, the temperature was naturally raised for 15min, the temperature was maintained at 110-115°C, and the reaction was carried out under nitrogen protection for 60min.

[0052] (3) Keep at 110-115 ℃, add 0.25 parts of 2,2-dimorpholinoethyl ether, 0.25 parts of...

Embodiment 2

[0055] A fast-positioning low-shrinkage UV moisture dual-curing polyurethane hot-melt adhesive, comprising the following raw materials:

[0056]

[0057] In the present embodiment, the described preparation method is as follows:

[0058] (1) 35 parts of self-made difunctional diols, 21 parts of polyethylene adipate, 10 parts of polyethylene terephthalate, and two parts of polyadipate-hexanediol-neopentyl glycol 13 parts of alcohol, mixed evenly, vacuumed and dehydrated at 120-125°C for 2 hours, the vacuum degree was guaranteed to be ≤-0.098MPa, and the measured water content was ≤100ppm for the next step.

[0059] (2) The mixed polyol was cooled to 80-85°C, 18 parts of diphenylmethane diisocyanate were added, the temperature was naturally raised for 15min, the temperature was maintained at 110-115°C, and the reaction was carried out under nitrogen protection for 60min.

[0060] (3) Keep at 110-115 ℃, add 0.25 parts of 2,2-dimorpholinoethyl ether, 0.25 parts of silane coupl...

Embodiment 3

[0063] A fast-positioning low-shrinkage UV moisture dual-curing polyurethane hot-melt adhesive, comprising the following raw materials:

[0064]

[0065] In the present embodiment, the described preparation method is as follows:

[0066] (1) 25 parts of self-made difunctional diols, 22 parts of polyhexanediol adipate, 24 parts of polyadipate-hexanediol-neopentyl glycol ester diol, poly-2-terephthalate 10 parts of methyl-1,3-propanediol ester glycol, mixed evenly, vacuum dehydration at 120-125 ℃ for 2 hours, the vacuum degree is guaranteed to be ≤-0.098MPa, and the measured water content is ≤100ppm, and the next step is performed.

[0067] (2) Cool the mixed polyol to 80-85°C, add 16 parts of diphenylmethane diisocyanate, naturally heat up for 15min, keep at 110-115°C, and react under nitrogen protection for 60min.

[0068] (3) Keep at 110-115 ℃, add 0.25 parts of 2,2-dimorpholinoethyl ether, 0.25 parts of silane coupling agent A189, 1.5 parts of photoinitiator 184, 1 part ...

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Abstract

The invention provides a fast-positioning low-shrinkage UV moisture dual-curing polyurethane hot melt adhesive and a preparation method thereof, and relates to the field of adhesives, flexible polyurethane modified dihydric alcohol with acrylate double bonds is prepared, the double bonds capable of being subjected to free radical photopolymerization are introduced into a polyurethane prepolymer, and UV illumination is carried out to obtain the fast-positioning low-shrinkage UV moisture dual-curing polyurethane hot melt adhesive. The prepolymer side chain with double bonds can be subjected to free radical photopolymerization to form a certain degree of crosslinking, so that the cohesion of the colloid is rapidly improved, the rapid positioning effect is achieved, and the main chain segment reaches the final strength through later moisture curing. In addition, the polyurethane modified polyether glycol is good in molecular chain flexibility and high in molecular adjustable degree, the flexible long chain can relieve shrinkage caused by colloidal crystallization formed by main chain crystalline polyester polyol, the cohesion strength of the colloid is guaranteed, the impact resistance of the colloid is improved, and the polyurethane modified polyether glycol has a great application prospect in the aspect of intelligent wearing.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a fast-positioning low-shrinkage UV moisture dual-curing polyurethane hot-melt adhesive and a preparation method thereof. Background technique [0002] At present, my country's smart wearable device market is showing a rapid and stable development trend. As smart wearable electronic products require thinner, narrower edges, larger screens and higher efficiency, higher requirements are placed on adhesives. PUR hot melt adhesive itself is solvent-free, safe and non-toxic, and meets the requirements of smart wear. However, due to the relatively slow curing speed of PUR hot melt adhesive, it takes a long time after construction to reach the final strength. Therefore, rapid positioning, forming higher bonding strength in a relatively short time, saving pressure holding time, and improving production efficiency have become problems to be solved urgently. [0003] The invention prepares a UV...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C08G18/32C08G18/42C08G18/48C08G18/67C08G18/66
CPCC09J175/14C08G18/672C08G18/4854C08G18/3206C08G18/4238C08G18/4213C08G18/6677Y02E10/50
Inventor 孙少芳李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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