Ejector pin type ball mounting jig

A ball-planting and thimble technology, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of affecting accuracy, contamination of the ball-mounting jig, and insufficient machining accuracy of the ball-mounting jig, so as to solve the problem of reducing precision and guaranteeing The effect of flatness
CN114783902APending Publication Date: 2022-07-22SHANGHAI TECHSENSE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI TECHSENSE CO LTD
Publication Date
2022-07-22

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Abstract

The invention discloses an ejector pin type ball mounting jig which comprises a ball mounting jig body, a pin plate and ejector pins, the pin plate is additionally arranged above the ball mounting jig body, the ejector pins are fixed in the pin plate, a plurality of pin holes corresponding to the ejector pins are formed in the ball mounting jig body, a ball suction hole is formed in the head of the ball mounting jig body, and the position of each ejector pin corresponds to the hole position of the ball suction hole. And the ejector pin moves up and down in the ball suction hole and is used for ejecting and separating the solder balls in the ball mounting jig. Lifting of the needle plate is controlled through an air cylinder or a motor. The needle plate is additionally arranged above the ball mounting jig, lifting is controlled through the air cylinder or the motor, the tin balls are ejected out through the ejector pins in the needle plate, the situation that part of the tin balls are not separated from the ball mounting jig is avoided, the part, matched with the ejector pins, in the ball mounting jig is made of steel instead of graphite materials, and the problem that the precision is reduced due to abrasion in graphite holes is solved.
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Description

technical field

[0001] The invention relates to a ball-planting fixture, in particular to a ball-planting fixture in the form of a thimble. Background technique

[0002] BGA ball grid array packaging technology is an advanced high-performance packaging technology developed after the 1990s. Its outer leads are solder balls or solder bumps, which are distributed in an array on the bottom plane of the package substrate. Wafer-level ball placement is the process of placing solder balls directly on the pads of the wafer. The ball mounting process includes printing flux and solder ball mounting. The ball mounting technology is to precisely place the solder balls on the substrate plane where the flux has been printed.

[0003] Existing technical solutions:

[0004] Make holes corresponding to the positions where the balls need to be mounted on the ball-mounting fixture, and suck the corresponding solder balls from the ball-laying board or other ball-supplying mechanisms through ...

Claims

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