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2results about How to "Small temperature drift" patented technology

Analog front-end chip, analog front-end circuit and signal processing device

ActiveCN115149912BImprove bandwidth performanceSolving parasitic capacitanceDigital variable displayAmplifier modifications to reduce temperature/voltage variation
This application provides an analog front-end chip, an analog front-end circuit, and a signal processing device, including: a first operational amplifier module for amplitude adjustment of an electrical signal connected to a first input impedance network; and a second operational amplifier module for amplitude adjustment of an electrical signal connected to a second input impedance network. The second input impedance network has a different impedance than the first input impedance network. The first and second operational amplifier modules are integrated within the same chip. This solves the problem of parasitic capacitance and resistance sensitivity caused by external chip interconnections; avoids the influence of process deviations on the bandwidth of the signal transmission path; and easily achieves high bandwidth performance for the analog front-end circuit. Simultaneously, since all critical signal paths are within a single chip, the temperature characteristics are consistent, resulting in minimal system temperature drift.
Owner:RIGOL TECHNOLOGIES CO LTD

Test boards, test machines, and test systems for testing machines

ActiveCN224287064UImprove output performanceGuaranteed low temperature stabilityElectronic circuit testingTemperature control using electric meansTemperature controlElectrical connection
This application relates to the field of chip testing, and in particular to a test board, a test machine, and a test system for a tester. The test board includes a BE board, a PCB board, and a heat sink, stacked sequentially from bottom to top. The PCB board includes at least one test channel, which includes an analog area and a power area. A temperature sensor is provided in the analog area, and at least one heating element corresponding to the power area is provided on the heat sink. A control module is provided on the BE board, which is electrically connected to the temperature sensor and the heating element. The control module is used to acquire the temperature data of the analog area collected by the temperature sensor and to control the heating element according to the temperature data to keep the temperature of the analog area stable within a set range. This application uses air cooling coupled with active temperature control to control the temperature of the analog area, reducing the temperature drift of heat-sensitive devices in the test board during actual operation, thereby improving the output performance of the test board.
Owner:HANGZHOU CHANGCHUAN TECH CO LTD

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