This application relates to the field of
chip testing, and in particular to a
test board, a test
machine, and a test
system for a tester. The
test board includes a BE board, a PCB board, and a
heat sink, stacked sequentially from bottom to top. The PCB board includes at least one
test channel, which includes an analog area and a power area. A temperature sensor is provided in the analog area, and at least one
heating element corresponding to the power area is provided on the
heat sink. A control module is provided on the BE board, which is electrically connected to the temperature sensor and the
heating element. The control module is used to acquire the temperature data of the analog area collected by the temperature sensor and to control the
heating element according to the temperature data to keep the temperature of the analog area stable within a set range. This application uses
air cooling coupled with active
temperature control to control the temperature of the analog area, reducing the temperature drift of heat-sensitive devices in the
test board during actual operation, thereby improving the output performance of the test board.