Manufacturing method of high-precision pressure sensor based on silicon-silicon bonding
A pressure sensor and manufacturing method technology, applied in the field of silicon micromechanical sensors, can solve the problems of thin diaphragm deformation, difficult implementation of process means, sensitive resistor photolithography accuracy and precise control of appearance dimensions, etc., to reduce static pressure The effect of small error and deformation and reducing the difficulty of processing
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[0057] like figure 1 As shown, the pressure sensor of the present invention includes a sensitive silicon wafer layer 1 and a substrate silicon wafer layer 13, the back of the sensitive silicon wafer layer 1 is connected with a substrate silicon wafer layer 13, and the sensitive silicon wafer layer 1 and the substrate silicon wafer layer 13 adopt A silicon-silicon-bonding process forms a pressure-sealed cavity.
[0058] like figure 1 and figure 2 As shown, the sensitive silicon wafer layer is based on monocrystalline silicon material, a pressure diaphragm 10 is arranged on the surface of the chip, a concave silicon cup 11 is arranged under the pressure diaphragm, and a varistor 2 is arranged on the pressure diaphragm; The varistor 2 is divided into two sections and is composed of resistors connected by the P+ connection area 3. The varistor 2 is connected to the lead hole 6 through the P+ connection area 3. A metal lead 7 is arranged above the lead hole 6 of the P+ connectio...
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