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Solder resist layer coating device on circuit board

A solder resist layer and coating device technology, which is applied in the field of solder resist, can solve problems such as low work efficiency, fatigue, and influence on circuit board processing, and achieve the effects of improving efficiency, facilitating processing, and ensuring consistent thickness

Inactive Publication Date: 2022-07-22
四川敏山电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When processing circuit boards, it is sometimes necessary to coat a layer of solder resist on the surface of the circuit board. Traditional solder resist coating is done manually, which not only has low work efficiency, but also requires manual operation for a long time and is easy to Cause fatigue, affect the uniformity of the solder resist coating, cause the thickness of the solder resist coating on the surface of the circuit board to vary, and affect the further processing of the circuit board

Method used

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  • Solder resist layer coating device on circuit board
  • Solder resist layer coating device on circuit board
  • Solder resist layer coating device on circuit board

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Embodiment Construction

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] The present invention provides such as Figures 1 to 6 The shown device for coating a solder resist layer on a circuit board includes a base 1, a fixed box 2 is fixed on the left side of the top of the base 1, a rotating mechanism 3 is arranged in the inner cavity of the fixed box 2, and the right side of the rotating mechanism 3 is provided. Running through the fixed box 2 and fixing the movable box 4, the top of the movable b...

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Abstract

The invention discloses a device for coating a solder resist layer on a circuit board, and belongs to the technical field of solder resist glues.The device comprises a base, a fixed box is fixed to the left side of the top of the base, a rotating mechanism is arranged in an inner cavity of the fixed box, and the right side of the rotating mechanism penetrates through the fixed box and is fixedly provided with a movable box. The circuit boards are conveniently limited when falling into the inner cavity of the tray, the situation that the circuit boards shake when being coated with the solder resist and the coating quality is affected is prevented, through cooperation of a storage box, a water pump, a hose, a flow dividing box and a discharging pipe, the solder resist can be conveniently added to the tops of the multiple sets of circuit boards at the same time, the efficiency of coating the solder resist on the circuit boards is improved, and the practicability is high. And meanwhile, through cooperation of the rotating mechanism and the lifting adjusting mechanism, the movable part and the cotton brush can be adjusted up and down and rotated, the solder resist dripping on the top of the circuit board is evenly smeared, it is guaranteed that the thickness of the solder resist is consistent, and further machining of the circuit board is facilitated.

Description

technical field [0001] The invention relates to the technical field of solder resist, in particular to a solder resist layer coating device on a circuit board. Background technique [0002] Solder mask is a new type of solder mask that replaces traditional high temperature tapes. It can effectively help users maximize production efficiency, product quality, and provide reasonable and variable production process solutions. Product features: It is attached to the coated area of ​​the circuit board until it is removed by hand or tweezers, and no glue residue is left. The glue is a neutral glue, resistant to acid and alkali, and has no corrosive effect on all materials. [0003] When processing the circuit board, sometimes it is necessary to coat a layer of solder resist on the surface of the circuit board. The traditional coating of solder resist is carried out manually, which not only has low work efficiency, but also manual operation, long-term labor, and easy Cause fatigue...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/28
Inventor 杨敏冯琳吴其银彭山
Owner 四川敏山电子科技有限公司
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