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Semiconductor device and manufacturing method thereof

A semiconductor and device technology, applied in the field of semiconductor devices, can solve the problems that the bonding wire cannot be wrapped in the package PC, exposed, and the bending height is high

Inactive Publication Date: 2004-04-28
LAPIS SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, if the bending height is too high in this case, then, when a thin package PC is assembled as shown in Fig. question

Method used

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  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof

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Embodiment Construction

[0026] The following is an explanation of related embodiments of a semiconductor device and its manufacturing method proposed according to the present invention. FIG. 1 is a schematic diagram illustrating a first embodiment. Just as shown in the schematic plan view in FIG. 1(a), the semiconductor device of the first embodiment has an LOC structure, and is provided with an on-chip semiconductor element 1, and a plurality of pins L and common lines 2a and 2b pass through the semiconductor element 1. The insulating tape T on the substrate 1a is connected to provide electrical connections for the electrode pads that handle common signals among the many electrode pads on the substrate 1a, and the bonding wire W that electrically connects the electrode pads to the pin L.

[0027] In this semiconductor device, the common line 2a constitutes a power line by being electrically connected to the electrode pad P1 connected to the power supply, and the common line 2b constitutes a ground w...

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Abstract

A semiconductor device includes a plurality of electrode pads P provided on a semiconductor element 1, leads L coupled with the electrode pads via bonding wires W and common lines 2a and 2b provided on the semiconductor element 1 that achieve electrical continuity for electrode pads that handle a common signal among the plurality of electrode pads. At least the surfaces of the common lines 2a and 2b are covered with an insulating member, i.e., a second insulating adhesive tape. With this, the loops of the bonding wires can be lowered, thereby achieving a thinner package.

Description

technical field [0001] The present invention relates to a semiconductor device and a method of manufacturing the semiconductor device. More particularly, the present invention relates to a semiconductor device having a common line providing electrical connection to those electrode pads handling common signals among a plurality of electrode pads on a semiconductor element and a method of manufacturing the semiconductor device. Background technique [0002] FIG. 6 is a schematic diagram showing an example of the prior art. This semiconductor device consists of a LOC (Lead On Chip) structure and is provided with an on-chip semiconductor element 1, a plurality of leads L and common lines 2a' and 2b' connected through insulating tape T on the semiconductor element 1. [0003] In addition, among these numerous electrode pads, the electrode pad P1 connected to the power supply is connected to the common line 2a' through the bonding wire W, and the electrode pad P2 connected to the...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L23/495
CPCH01L2924/01015H01L2224/45124H01L2924/01046H01L2924/01082H01L2924/00014H01L2224/4826H01L2924/01004H01L2224/48699H01L2924/01019H01L2924/01029H01L24/78H01L2224/0401H01L23/4951H01L2224/48091H01L2224/05556H01L2224/49171H01L2224/78H01L2924/01013H01L2924/014H01L24/48H01L24/49H01L2224/4899H01L2924/01021H01L24/03H01L24/45H01L24/06H01L2224/85399H01L24/05H01L2224/48465H01L2224/48247H01L24/85H01L2224/45099H01L2224/04042H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01074H01L2224/05599H01L2224/49175H01L2224/02166H01L2224/023H01L2224/05554H01L2924/07802H01L2924/181H01L2924/00H01L2924/00012H01L2924/0001H01L21/60
Inventor 内田康文
Owner LAPIS SEMICON CO LTD
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