Energy-saving type wafer processing grinding device with dust removal structure

Abstract

The invention discloses an energy-saving type wafer processing grinding device with a dust removal structure. Comprising a rack, a first mounting cavity, a second mounting cavity, a fixing assembly, a machining table, a third mounting cavity, a fourth mounting cavity, a first motor, a first rotating shaft, a first gear, a second gear, a second rotating shaft, a clamp, a dust removal assembly, a second motor, a third rotating shaft, a first connecting rod, a liquid dropping assembly, a wafer body, an oil cylinder, a driving box and a grinding disc. Compared with an existing grinding device for wafer processing, the designed fixing assembly can clamp and fix wafers of different sizes, and the applicability is improved; according to the dust removal assembly designed by the invention, chippings on the machining table can be thrown out through intermittent reverse rotation, so that subsequent machining is prevented from being hindered; according to the designed liquid dropping assembly, the liquid dropping angle can be freely adjusted, so that the corrosive liquid can be accurately dropped to any point on the surface of the wafer, and the grinding efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to an energy-saving wafer processing grinding device with a dust removal structure. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. In order to reduce the thermal resistance of the device, improve the working heat dissipation and cooling capacity, and facilitate the packaging, after the integrated circuit is fabricated on the front side of the silicon wafer, the backside thinning, that is, wafer grinding, needs to be carried out. However, the existing grinding equipment for wafer processing, Most of them can only process wafers of specific specifications, and their applicability is low; the existin...

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Problems solved by technology

[0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer and become an IC with specific electrical functions. In order to reduce the thermal resistance of the device, improve the heat dissipation and cooling capacity of the work, and facilitate the packaging, after the integrated circuit is fabricated on the front side of the silicon wafer, the back side needs to be thinned, that is, wafer grinding. However, the existing grinding device for wafer processing, Most of them can only process wafers of specific specifications, and their applicability is low; the existing grinding devices for wafer processing lack the dust removal function, and the debris generated by processing tends to remain on the processing plane, which is not conducive to subsequent wafer grinding; Some grinding devices for wafer processing, when dripping the etching solution, mostly drop it on the processing plane and then contact the wafer, which is not conducive to precise etching and grinding

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