Contact improved test head between contact probe and guide hole

Abstract

A test head (20) for testing the functionality of an electronic device comprises: a plurality of contact probes (10, 10bis) comprising probe bodies (10 ') extending longitudinally between respective ends (10a, 10b) adapted to contact respective contact pads; at least one lower guide (40) provided with a guide hole (40h) for slidably receiving the contact probe (10, 10bis); and a conductive portion (21) in the lower guide (40), the conductive portion (21) comprising at least one set of holes (40h ') of the guide holes (40h) and being adapted to contact and short-circuit a corresponding set of contact probes (10) housed in the set of holes (40h') for carrying a specific type of signal. Suitably, at least the contact probe (10) housed in the set of holes (40h ') comprises an elastically deformable portion (P) adapted to be at least partially inserted into the set of guide holes (40h'), wherein the portion (P), when received in the set of guide holes (40h '), is in a configuration that deforms due to contact with at least one wall (40hW) of the guide holes and exerts a reaction force (F) on the wall (40hW) to ensure sliding contact during testing of the electronic device.

Description

technical field [0001] The present invention relates to a test head, which is suitable for testing electronic devices integrated on a semiconductor wafer. The following description is only made with reference to the application field, and its sole purpose is to simplify its description. Background technique [0002] As is well known, a test head is essentially a device suitable for connecting a plurality of contact pads of a microstructure (in particular an electronic device integrated on a semiconductor wafer) with its functional test (in particular electrical test, or general test) ) is electrically connected to the corresponding channel of the test device. [0003] Testing of integrated circuits is particularly useful for detecting and isolating defective circuits as early as the production stage. Therefore, test heads are often used to test circuits integrated on wafers before they are diced and assembled into chip packages. [0004] The test head essentially comprises...

AI Technical Summary

Problems solved by technology

[0009] However, it is notoriously often impossible to ensure an effective electrical connection between the probe tip and the metallization, leading to an unacceptable limitation in the overall performance of the test head

In other words, it is not always possible to ensure proper sliding contact between the contact probe and the wall of the guide hole, so that the frequency performance of the test head is often limited

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