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Film pasting method applied to chemical immersion plating process

A chemical immersion plating and process technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as seepage, achieve the effects of reducing gaps, improving yield, and reducing gaps

Pending Publication Date: 2022-08-02
HUA HONG SEMICON WUXI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The embodiment of the present application provides a film sticking method applied in the chemical immersion plating process, which can solve the problem that the film sticking method provided in the related art is easy to cause seepage after the chemical immersion plating process, and the method includes:

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  • Film pasting method applied to chemical immersion plating process
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  • Film pasting method applied to chemical immersion plating process

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Embodiment Construction

[0024] The technical solutions in the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0025] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a ...

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Abstract

The invention discloses a film pasting method applied to a chemical immersion plating process, and the method comprises the steps: providing a wafer which is thinned by adopting a Taiko thinning process, the back surface of the wafer comprises an edge region and a central region, the edge region is located at the peripheral side of the central region, and the edge region is higher than the central region when being observed from a side view angle; attaching a first protective film to the central area; attaching a second protective film to the back surface; and performing a chemical immersion plating process on the wafer. According to the invention, before the chemical immersion plating process is carried out on the wafer which is thinned by adopting the Taiko thinning process, the first protective film is attached to the central area in the process of carrying out film protection on the back surface of the wafer, so that the offset of the back surface of the wafer is reduced, and after the second protective film is attached to the first protective film on the back surface of the wafer, the thickness of the wafer is reduced. The gap of the edge area is reduced, so that the seepage phenomenon in the chemical immersion plating process is improved to a certain extent, and the yield of products is improved.

Description

technical field [0001] The application relates to the technical field of semiconductor manufacturing, and in particular to a film sticking method applied in a chemical immersion plating process. Background technique [0002] Taiko thinning process is a thinning process developed by Japan's DISCO company. This process does not thin the entire plane of the wafer, but only thins the central area of ​​the wafer. The width of the edge region without thinning is about 2 mm to 5 mm, which forms the support ring. The support ring can provide support for the wafer and reduce the warpage of the wafer. Therefore, detecting the width of the support ring can monitor the stability of the grinding equipment to ensure that the wafer thinning concentricity is not offset, otherwise there will be post-process fragments risks of. [0003] Chemical immersion plating (chemical plating, referred to as "chemical plating") is a plating method in which metal ions in the plating solution are reduced...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/60C23C18/18
CPCH01L21/02016H01L24/11C23C18/1614C23C18/1605C23C18/1642C23C18/1851H01L2224/11464
Inventor 陈旋惠科石缪鏖泽席亚荣
Owner HUA HONG SEMICON WUXI LTD
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