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Novel heat exchange device for liquid cooling radiator

A technology of heat exchange device and radiator, which is applied in the fields of instruments, climate sustainability, computing, etc., can solve problems such as insufficient heat of liquid-cooled belts and reduced heat exchange efficiency of chips, so as to slow down the flow rate of water and improve heat exchange efficiency Effect

Pending Publication Date: 2022-08-05
DONGGUAN ZHENPIN PRECISION HARDWARE
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  • Abstract
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Problems solved by technology

Insufficient heating of the existing liquid-cooled belt, resulting in a greatly reduced heat exchange efficiency of the chip

Method used

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  • Novel heat exchange device for liquid cooling radiator
  • Novel heat exchange device for liquid cooling radiator
  • Novel heat exchange device for liquid cooling radiator

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Embodiment Construction

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0028] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

[0029] It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside", etc. indicate the orientation or positional rel...

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Abstract

The invention relates to the technical field of chip cooling, in particular to a novel heat exchange device for a liquid-cooled radiator, in the using process, cold liquid cooled by a radiator firstly flows into a water collecting tank and then synchronously flows into a micro water channel through water inlets in the two sides of the micro water channel and two water inlet channels, and the heat exchange device is used for heat exchange of the liquid-cooled radiator. Due to the fact that the water inlet directions of the two water inlet channels and the water inlet directions of the water inlets in the two sides of the micro-water channel intersect in a one-to-one correspondence mode, water flow in the micro-water channel forms intersecting water flow, the water flow speed is slowed down to a certain degree, meanwhile, a plurality of water flow vortexes can be formed in the micro-water channel, and the water flow speed is increased. The water flow layer on the surface layer of the cold liquid is driven by water flow vortexes to continuously replace the water flow layer on the bottom layer of the cold liquid, so that the cold liquid can fully absorb heat on the cold head bottom plate, the heat is finally collected through the water outlet channel and flows out of the water collecting tank together, and the purpose of improving the heat exchange efficiency of a chip is achieved.

Description

technical field [0001] The invention relates to the technical field of chip cooling, and more particularly to a novel heat exchange device for a liquid cooling radiator. Background technique [0002] With the increasing power consumption of CPU, GPU and other chips, a large amount of heat will be generated during operation. The heat sink is used to quickly take away the surface heat, thereby reducing the internal temperature of the chip and ensuring the stable and long-term normal operation of the chip. It has become a top priority. [0003] At present, the main types of chip heat dissipation are air-cooled radiators and liquid-cooled radiators. Among them, there are two biggest features of the liquid cooling radiator: balanced chip heat and low noise work. [0004] Due to the large specific heat capacity of water and low cost, the liquid in the liquid cooling is water, which can absorb a large amount of heat and keep the temperature of the chip from changing significantly....

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20Y02D10/00
Inventor 盛宝华喻虹
Owner DONGGUAN ZHENPIN PRECISION HARDWARE
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