Mechanical planarization apparatus

A mechanical flattening and equipment technology, applied in metal processing equipment, grinding/polishing equipment, grinding machine parts, etc., can solve the problem that the jaws cannot clamp wafers with trimmed edges, etc. Improve the quality of processing, reduce the contact area, and reduce the effect of residue

Active Publication Date: 2022-08-09
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Therefore, in order to solve the defect that the existing jaws cannot clamp the wafer with trimming, a kind of mechanical planarization equipment is provided, which includes:

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mechanical planarization apparatus
  • Mechanical planarization apparatus
  • Mechanical planarization apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0050] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element mus...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a clamping jaw and mechanical planarization equipment, and belongs to the technical field of wafer mechanical planarization, the clamping jaw comprises a polishing unit, a scrubbing unit, a drying unit and a manipulator, the manipulator comprises a mechanical arm and a clamping jaw connected to the mechanical arm; the clamping jaw comprises a mounting plate, two clamping pieces and a driving piece, the two clamping pieces are both connected to the mounting plate, and the driving piece is connected with at least one clamping piece and used for driving the two clamping pieces to move close to or away from each other. Clamping faces are symmetrically arranged on the side portions, close to each other, of the two clamping pieces, the clamping faces are arc faces with the radius consistent with the radius of the wafer, and the chord length corresponding to the arcs of the clamping faces is larger than the trimming length of the wafer. Through the arrangement of the clamping faces, the clamping jaw can clamp and position a standard circular wafer and a wafer with a cut edge, the structure is simple and reliable, and the positioning precision in the wafer carrying process is improved.

Description

technical field [0001] The present invention relates to the technical field of wafer mechanical planarization, in particular to a mechanical planarization device. Background technique [0002] refer to figure 1 , Wafers made of third-generation semiconductor materials will have a trimmed edge. At present, common mechanical planarization equipment is mainly for polishing wafers with a standard circular shape, and polishing wafers with trimmed edges. When it is used, there will be problems of inaccurate positioning and deviation of the center of the circle due to the existence of trimming, which will seriously affect the processing quality of the wafer. question. SUMMARY OF THE INVENTION [0003] Therefore, in order to solve the defect that the existing clamping jaws cannot clamp wafers with trimmed edges, a mechanical planarization device is provided, which includes: [0004] storage boxes for storing wafers; [0005] a polishing unit, arranged on one side of the storag...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/06B24B41/00
CPCB24B29/02B24B41/06B24B41/00Y02P70/50
Inventor 史霄尹影费玖海舒福璋吴尚东
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap