Power device heat dissipation structure topology design method and system based on SIMP

Abstract

The invention provides a power device heat dissipation structure topology design method and system based on SIMP, and the method comprises the steps: obtaining a design region of a design object, and carrying out the grid division of the design region; design variables and initial values thereof, design parameters and constraint conditions are obtained, and a heat conduction material mathematical model is established based on SIMP; establishing a unit heat conduction matrix and an overall heat conduction matrix of a design object based on the model; establishing a topological design model of the heat dissipation structure based on the matrix; calculating the sensitivity of the target function, and analyzing the sensitivity of the design variable; calculating the target function based on the target function and the sensitivity of the design variable; and obtaining the optimal topological structure of the design object when the objective function meets the convergence condition. According to the method, topological optimization of the heat dissipation structure of the power device is carried out based on the SIMP model in the variable density method, the defects of a traditional design method are avoided, consumed time is short, cost is low, good numerical stability and feasibility are achieved, the product design efficiency is improved, and the product design period is shortened.

Description

technical field [0001] The present invention relates to the technical field of thermal design of electronic equipment, and in particular, to a method and system for designing a heat dissipation structure topology of a power device based on SIMP. Background technique [0002] Power device is the key device in electronic equipment, which generates a large amount of heat. The quality of its thermal design directly affects the reliability of the system. [0003] With the development of science and technology and the advancement of the times, the power density of electronic devices has become higher and higher, and the requirements for heat dissipation performance have become higher and higher. The design of traditional heat dissipation structures is generally completed through basic knowledge of heat transfer and engineering practice experience. This method is difficult to realize the design of complex heat dissipation structure. Traditional structural design methods can no lon...

AI Technical Summary

Problems solved by technology

This method is difficult to realize the design of complex heat dissipation structure

Traditional structural design methods can no longer meet the high-performance requirements of thermal protection structures in actual engineering. The development of topology optimization design technology has brought a new approach to the design of thermal protection structures for electronic equipment.

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