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Multi-layer stacked star-shaped parallel current-sharing connection structure and connection method thereof

A multi-layer stacking and flow connection technology, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of asymmetrical heat dissipation structure, large temperature rise, and inability to make full use of the space in the vertical direction. Achieve the effect of reducing uneven current problems and high current on-off capability

Pending Publication Date: 2022-08-09
ZHEJIANG FANGYUAN ELECTRICAL EQUIP TESTING +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (1) Such a parallel arrangement can only slightly reduce the impedance difference of each thyristor circuit. When the current is large, there will still be serious uneven current problems.
[0006] (2) In a high-current scenario, when a large number of parallel groups is required, the horizontal size will be large, and the equipment occupies a large area, which cannot make full use of the vertical space
[0007] (3) The heat dissipation structure is asymmetrical. The current flowing through the thyristors and copper bars in the middle part is large, and the overall temperature rise will be greater, and the temperature rise will bring about changes in the characteristics of the thyristors, resulting in the current flowing through each thyristor path. Temperature changes are not conducive to overall current sharing control

Method used

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  • Multi-layer stacked star-shaped parallel current-sharing connection structure and connection method thereof
  • Multi-layer stacked star-shaped parallel current-sharing connection structure and connection method thereof
  • Multi-layer stacked star-shaped parallel current-sharing connection structure and connection method thereof

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Embodiment Construction

[0031] The following description serves to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments described below are given by way of example only, and other obvious modifications will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

[0032] In the preferred embodiment of the present invention, those skilled in the art should note that the thyristor and the like involved in the present invention may be regarded as the prior art.

[0033] Preferred embodiment.

[0034] The invention discloses a multi-layer stacked star parallel connection method for current sharing, which is used to realize the current sharing of thyristors, comprising the following steps:

[0035] Step S1 : the first thermally ...

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Abstract

The invention discloses a multi-layer stacked star-shaped parallel current-sharing connection structure and a connection method of the multi-layer stacked star-shaped parallel current-sharing connection structure. The multi-layer stacked star-shaped parallel current-sharing connection method comprises the following steps: S1, a first heat-conducting aluminum plate and a second heat-conducting aluminum plate are oppositely arranged in parallel, and a first thyristor and a second thyristor which are reversely connected in parallel are fixedly mounted between the first heat-conducting aluminum plate and the second heat-conducting aluminum plate, therefore, the first heat conduction aluminum plate, the second heat conduction aluminum plate, the first thyristor and the second thyristor form a thyristor branch part. According to the multi-layer stacked star-shaped parallel current-sharing connection structure and the connection method thereof disclosed by the invention, copper bar paths through which current passes are completely consistent, that is, impedance of loops is completely equal, unequal factors are reduced for overall current sharing, the difficulty of current sharing is greatly reduced, and a multi-layer stacked structure in the vertical direction is adopted, so that the current sharing difficulty is greatly reduced. And larger current capacity can be realized.

Description

technical field [0001] The invention belongs to the technical field of parallel current sharing of thyristors, and in particular relates to a multi-layer stacked star parallel current sharing connection structure and a multi-layer stacked star parallel current sharing connection method. Background technique [0002] As a high-power power electronic device, thyristor is widely used in AC rectification, switching angle control and other scenarios. However, due to the limitations of power electronic device technology and manufacturing technology, the capacity of a single thyristor is far from meeting the needs of industrial high-current use environments. Parallel connection of multiple thyristors is an effective method to improve the ability of equipment to carry and switch large currents, which can not only expand the application scope of the equipment, but also contribute to the redundancy design of the system. Whether the current distribution is balanced directly affects th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/10H01L23/367
CPCH01L23/3677H01L23/10H01L21/4875H01L21/4882
Inventor 董纪圣祝文婷张彦张立茜陆红玉朱明华费婉亲王平成潘丽杰赵飞周正卿朱琪徐本亮
Owner ZHEJIANG FANGYUAN ELECTRICAL EQUIP TESTING