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Planar plastic packaged module of integrated circuit

A chip package and encapsulant technology, applied in the direction of circuits, electrical components, electrical solid devices, etc.

Inactive Publication Date: 2004-12-15
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Even if the chip does not crack, package warping can cause serious problems during the soldering process that secures the module lead frame to the printed circuit board

Method used

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  • Planar plastic packaged module of integrated circuit
  • Planar plastic packaged module of integrated circuit
  • Planar plastic packaged module of integrated circuit

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Experimental program
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Effect test

Embodiment Construction

[0025] The inventors have realized that by balancing the various forces within the plastic package, bending can be reduced or avoided. They realized that when the thickness of the plastic above the leadframe was different than the thickness below the leadframe, the package behaved like a bimetallic strip and flexed in response to temperature. To reduce or avoid bending, the inventors provided an additional layer of material in the plastic at a different layer than the lead frame where the leads are connected, in order to balance the forces. In one embodiment, a portion of the leadframe material is bent to a different layer than the layer used for the remainder of the leadframe in order to balance the forces. In another embodiment, the lead fingers are bent down and back up to better balance the forces on the lead fingers.

[0026] Such as Figure 1a As shown, the underlying tie bars 20 of the leadframe 22 are bent at bend points 24 a and 24 b within the plastic encapsulant 26...

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PUM

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Abstract

A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

Description

technical field [0001] The present invention relates generally to plastic packages for integrated circuits. Rather, it relates to improved structures designed to reduce bowing of plastic packaged modules and provide flatter modules. More specifically it relates to an improved lead frame that provides a flatter module. Background technique [0002] Generally, an integrated circuit chip is electrically connected to the outside through a highly conductive lead frame. The chip's wire-bond pads are connected by thin, 1-mil diameter wire to thicker and tougher leadframe conductors. The chip, flexible wire, and adjoining parts of the lead frame are encapsulated in molded plastic to protect the chip and wire from damage, while the lead frame conductors extending out of the plastic can be used for soldering to, for example, printed circuit The next level of equipment such as boards. Thousands of modules of this type are sold every year. [0003] A number of issues have been iden...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/28H01L21/56H01L23/16H01L23/495H01L23/50
CPCH01L2924/01029H01L23/49551H01L2924/10253H01L2224/4826H01L23/4951H01L24/48H01L2224/48091H01L2224/48465H01L2224/48247H01L23/16H01L2224/05599H01L2224/45015H01L2224/85399H01L2924/00014H01L2924/14H01L2924/00H01L2924/20752H01L2924/00012H01L2224/45099H01L2924/207H01L23/495
Inventor D·V·卡勒特卡J·L·卡尔珀J·P·辛克塔K·B·霍斯福德G·H·伊里什小J·J·拉扎小G·C·奥斯博内C·R·拉姆齐R·M·史密斯M·J·瓦德纳斯
Owner IBM CORP