Pressure sensor and its manufacturing method
A pressure sensor and sensing element technology, applied in the direction of measuring fluid pressure, measuring fluid pressure through electromagnetic elements, instruments, etc., can solve the problems of the size and shape of the connector part, increasing the installation area of capacitors, difficult and other problems
Inactive Publication Date: 2005-06-29
DENSO CORP
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Problems solved by technology
Therefore, when the capacity of the capacitor 300 is increased in order to improve EMC resistance, the capacitor 300 will be difficult to mount.
Usually, in order to connect with external connectors, the size and shape of the connector part 110 will be limited
Thus, in the integrally molded case 100, it is difficult to increase the mounting area of the capacitor without being limited by the connector portion 110.
Method used
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[0022] The preferred embodiments of the present invention will now be described with reference to the drawings. In this preferred embodiment, the pressure sensor S1 shown in FIG. 1 is generally used to detect the pressure of the refrigerant in an air conditioner installed on, for example, a vehicle.
[0023] Pressure sensor S1 contains figure 2 The housing part 10 is shown. figure 2 Shows the situation when the housing part 10 is separated. At this time, the housing part is divided into a first housing 11 and a second housing 12. As shown in FIGS. 1 and 2, the housing member 10 is constructed by assembling the first housing 11 and the second housing 12 together. Both the first housing 11 and the second housing 12 are integrally molded using resin such as polyphenylene sulfide (PPS) or polybutylene terephthalate (PBT) through one-step molding.
[0024] The first housing 11 is shaped into an approximately cylindrical shape with a stepped portion. The groove portion 13 is formed in...
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In the pressure sensor, a sensing element (40) is mounted on one side of a first surface (11a) of a first housing (11), and a second housing (12) with a cylindrical hollow portion is glued On the first casing, to cover a part of the surface of the second surface (11b) of the first casing opposite to the first surface. A terminal (20) is embedded in the first housing so as to protrude from the second surface, and a branch portion (21) is branched from the embedded portion of the terminal in the first housing so as to have a an exposed portion (22) exposed on the second surface. A chip capacitor (60) is mounted on the exposed portion on the second surface so as to be electrically connectable to the exposed portion. In the pressure sensor, the diameter (D1) of the second surface of the first housing is larger than the inner diameter (D2) of the hollow portion at the protruding tip of the terminal.
Description
Technical field [0001] The present invention relates to a pressure sensor including a sensing element arranged in a housing having terminals for electrically connecting the sensing element to the outside. In particular, the pressure sensor includes a capacitor for improving electromagnetic compatibility (EMC) resistance. Background technique [0002] The pressure sensor described in Japanese Patent JP-A-7-243926 includes a sensor element for detecting pressure and a housing containing the sensor element. There are a plurality of terminals for electrically connecting the sensing element to the outside in the housing. However, in this pressure sensor, due to the radiation of electromagnetic waves, the clutter current can be easily applied to the sensing element, so that the sensing element may perform an erroneous operation. In other words, the EMC resistance is reduced. [0003] In order to overcome this problem, capacitors that limit the spurious current are usually installed in ...
Claims
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IPC IPC(8): G01L9/00
CPCG01L19/0084G01L19/0645G01L19/142
Inventor 竹菴宪治黑田道毅宫川治彦
Owner DENSO CORP