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Wire-width measuring method and apparatus thereof

A measurement device and measurement method technology, applied in the direction of measurement devices, optical devices, image data processing, etc., can solve problems such as inaccurate measurement

Inactive Publication Date: 2005-09-21
V TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the lower length BNab is not actually a measured value, so there is a disadvantage that it cannot be measured correctly

Method used

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  • Wire-width measuring method and apparatus thereof
  • Wire-width measuring method and apparatus thereof
  • Wire-width measuring method and apparatus thereof

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Embodiment Construction

[0051] In one embodiment of the present invention, a glass substrate on which a thin film pattern has been formed is placed on an XY stage, and illumination light is irradiated from the side of the substrate on which the thin film pattern has not been formed (substrate rear side) of the substrate on which the thin film pattern has been formed. , and measure it. When using the existing device shown in Figure 3 to measure the backside of the substrate, the surface side of the substrate (the side on which the thin film pattern is formed) contacts the adsorption plate 3, which will destroy the drawn pattern of the integrated circuit, so it is necessary to The surface side of the substrate and the adsorption plate 3 are held in contact.

[0052] Therefore, in one embodiment of the present invention, the measurement sample 1 is arranged roughly in the longitudinal direction, the periphery of the substrate back side (the side where the thin film pattern is not formed) of the measurem...

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Abstract

There is provided an apparatus for measuring a line width, which is capable of measuring directly and correctly the width of the bottom portion of a pattern on a specimen to be measured regardless of the shape of the cross section thereof. The apparatus includes an optical microscope for producing an optical image of an object on a transparent substrate, a photographing part for transforming the optical image of the object into an electrical image signal, and a measurement controlling part which processes the electrical image signal to measure a line width of the object. The transparent substrate is held vertically by a fixing part and the optical microscope is disposed in such a way that it is opposite to the object to be measured with respect to the transparent glass.

Description

technical field [0001] The present invention relates to a line width measuring device and method for measuring the line width of a pattern formed on transparent glass using an optical microscope and an imaging device. Background technique [0002] A device for measuring the line width of wiring patterns formed on semiconductor wafers and glass substrates using two-dimensional image sensors such as optical microscopes and CCD cameras, especially measuring and inspecting film formation patterns such as wiring formed on transparent substrates (for example, thin film patterns) ) line width and pattern interval line width measurement device, has been used for a long time. The so-called transparent substrate is, for example, a substrate such as glass (hereinafter referred to as glass) that transmits light (such as visible light, infrared rays, ultraviolet rays, X-rays, etc.) substrate). [0003] At present, such a glass substrate is used as a display substrate of a plasma displa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/02G02B21/36G06T1/00H04N5/225
CPCG01B11/005G01B11/03G01B11/043G01B11/046G01B11/0608
Inventor 小菅正吾久木原美智男广川智清水高博
Owner V TECH CO LTD