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Laminated ceramic electronic component and manufacturing method thereof

A technology of electronic components and manufacturing methods, applied in the field of structure and formation of external terminal electrodes of laminated ceramic electronic components, capable of solving problems such as increasing edge angles

Inactive Publication Date: 2006-05-10
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0042] The present invention is aimed at solving the problem caused by the small edge angle of the external terminal electrode, not by increasing the edge angle, but by other means.

Method used

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  • Laminated ceramic electronic component and manufacturing method thereof
  • Laminated ceramic electronic component and manufacturing method thereof
  • Laminated ceramic electronic component and manufacturing method thereof

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Embodiment Construction

[0102] figure 1 A sectional view for explaining the first embodiment of the present invention, figure 1 In (4), the multilayer ceramic electronic component 21 is shown in a cross-sectional view, figure 1 (1) to figure 1 (3) The steps performed to manufacture the multilayer ceramic electronic component 21 are sequentially shown in cross-sectional views.

[0103] refer to figure 1 (4), the laminated ceramic electronic component 21 has a component body 23 composed of laminated multilayer ceramic layers 22, and a plurality of internal conductor films 24 and some through holes as internal circuit elements arranged inside the component body 23 Conductor 25. These inner conductor films 24 and via conductors 25 are electrically connected to each other to provide wiring required in the multilayer ceramic electronic component 21 or to constitute passive elements such as capacitors and / or inductors.

[0104] Several external terminal electrodes 27 are provided on the first main...

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Abstract

In a multilayer ceramic electronic component, if the edge angle of the external terminal electrode formed by firing the conductive paste is small, the loss when used in a high frequency band increases. The external terminal electrode 27 of the present invention forms a buried portion 32 at its edge so that it extends and embeds in the component body 23 made of the ceramic layer 22, so that it will not be affected by the small edge angle.

Description

technical field [0001] The present invention relates to a multilayer ceramic electronic component and its manufacturing method, and more particularly to the structure and method of forming the external terminal electrodes of a multilayer ceramic electronic component such as a multilayer ceramic substrate. Background technique [0002] For example, electronic components such as chip wireless, delay line, high-frequency composite switch module and receiving device are mostly composed of laminated ceramic electronic components. Since such a multilayer ceramic electronic component is used mounted on a suitable mounting substrate, it has external terminal electrodes electrically connected to the mounting substrate. [0003] Figure 9 The part where the external terminal electrode 2 is formed is shown in cross-sectional view as a part of the conventional multilayer ceramic electronic component 1 which is interesting for the present invention. [0004] Figure 9 The composition of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/00H05K3/40H01L21/60H01L23/498H05K1/03H05K3/46
CPCH01L23/49822H01L2924/0002H01L2924/09701H05K1/0306H05K3/4007H05K3/4611H05K3/4629H01L2924/00
Inventor 酒井范夫西出充良水白雅章洼田宪二铃木信幸
Owner MURATA MFG CO LTD