Apparatus for preventing liquid spitting back

Abstract

The present invention provides a device for preventing a liquid from splashing back on an object, in particular to a device for preventing splashing back into a developing process, which at least includes: a rotator, on which the above-mentioned object is placed, and a rotating device is used for rotating The rotating motion of the rotator separates the object from the liquid; a side wall surrounds the rotator to prevent the liquid from splashing outside the side wall; and a buffer cotton is attached to the inner side of the side wall to prevent the liquid from Side wall splashes back onto the object.

Description

technical field [0001] The invention relates to a device for preventing liquid from splashing back, in particular to a device for preventing back-splashing applied in a developing manufacturing process. Background technique [0002] In the semiconductor manufacturing process, to form a pattern in a film, it is usually necessary to form a photoresist layer on the film first, and then use a photomask with a pattern as a shield to expose the photoresist layer . At this time, photochemical transformation (photochemical transformation) reaction will occur in the area irradiated by light. [0003] Next, a development step is performed to reveal the potential pattern transferred from the photoresist layer, and the developed pattern is the basis for subsequent etching of the thin film layer. Therefore, the developing conditions must be strictly controlled to prevent the unexposed photoresist layer from being attacked by the developing solution, thereby affecting the accuracy of th...

AI Technical Summary

Problems solved by technology

However, the developing solution leaving the glass substrate 100 due to high-speed rotation may bounce back to the glass substrate 100 after colliding with the collecting cover 170, as shown by the arrow 160.

This kind of splashback phenomenon will cause the pattern deformation of photoresist, and produce defect 113 phenomenon, and then reduce the qualified rate of product

In particular, when the glass substrate 100 becomes thinner, the edge of the glass substrate 100 will increase the range of ups and downs, which will make the splash back more serious.

[0006] Therefore, even if the developing conditions such as developing time, developer concentration and temperature are properly controlled, if there is any negligence during the final spin-drying process, the accuracy of the pattern transferred to the photoresist layer will still be reduced

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