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Picking tool for assembling semiconductor chip

A semiconductor and chip technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as semiconductor chip bending

Inactive Publication Date: 2006-06-21
ESEC TRADING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for a thickness of about 150 μm, it may happen that the semiconductor chip picked up by the pick-up tool is bent because the semiconductor chip is pressed against the suction port by the pressure generated by the vacuum

Method used

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  • Picking tool for assembling semiconductor chip
  • Picking tool for assembling semiconductor chip
  • Picking tool for assembling semiconductor chip

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0023] In this specific embodiment, the suction mechanism 4 has an opening 8 which can be used to supply vacuum to the convex surface 6 facing the semiconductor chip 2 . The openings 8 are arranged close to the edge of the surface 6 and the center of the surface 6 is free of openings. Figure 2A and Figure 2B A plan view of surface 6 is shown. The opening 8 is, for example, parallel to the slit 10 distributed along the edge 9 of the suction mechanism 4, as Figure 2A as shown, or as Figure 2B As shown, a large number of boreholes 11 arranged in the region of the edge 9 are included.

[0024] Figure 2A A Cartesian coordinate system is also shown, with axes indicated by X and Y. The surface 6 is formed either as a convex surface relative to a single direction, for example the X direction, or as a convex surface relative to the X and Y directions.

[0025] image 3 Shown is a specific embodiment of the pick-up tool 1 for which the vacuum channel 18 extends as long as po...

example 2

[0027] based on Figure 4A and 4B In the illustrated embodiment, the suction mechanism 4 has a cavity 12 filled with a porous material, to which a vacuum is applied. The cavity 12 is located, for example, in the center of the surface 6 of the suction mechanism 4 .

[0028] When providing the slits 10 and / or the boreholes 11 according to example 1, there is the further possibility of filling the slits 10 and / or the boreholes 11 with a porous material.

[0029] Figure 5 and Figure 6 Each shows a snapshot of the process of placing a semiconductor chip 2 on top of a semiconductor chip 14 which has been mounted on top of a substrate 13 , no details of the pick-up tool 1 being provided. The adhesive film 15 is pasted to the back surface of the semiconductor chip 2 . Hereinafter, the semiconductor chip 2 means the semiconductor chip 2 and the adhesive film 15 bonded on its back side. Due to opening 8( figure 1 ) to make the semiconductor chip 2 itself adapt to the curvature ...

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PUM

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Abstract

For a pick-up tool (1) with a suction mechanism (4) made of elastically deformable material, the surface (6) for picking up a semiconductor chip (2) is machined convex. When placing the semiconductor chip (2) onto the assembled semiconductor chip (14), the center of the semiconductor chip (2) is first pressed. The convex surface (6) is gradually deformed under the gradually formed pressure until the convex surface and the picked-up semiconductor chip (2) are straight. The pressure is gradually formed outward from the center of the suction mechanism (4). Through this process, the semiconductor chip (2) is rolled onto the underlying semiconductor chip (14), wherein air can escape continuously.

Description

technical field [0001] The invention relates to a pick-up tool for mounting semiconductor chips. The term for such a tool is a "die chuck" or "die attach tool". Background technique [0002] During the assembly of semiconductor chips, semiconductor chips cut from a wafer and bonded to a sheet are picked up by a pick-up tool and placed on a substrate. This pick-up tool mainly includes a metal shaft and an air suction mechanism connected to the metal shaft. The suction mechanism has a cavity facing the semiconductor chip to be removed, and a vacuum can be applied to the cavity by drilling. Once the suction mechanism rests on the semiconductor chip, the vacuum causes the semiconductor chip to suck onto the suction mechanism. In the industry, the suction mechanism is known as a pick-up tool or rubber tip. [0003] Semiconductor chips are also mounted on top of each other, and such semiconductor chips mounted on top of each other are called "stacked chips" in the industry. U...

Claims

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Application Information

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IPC IPC(8): H01L21/50H05K13/00H01L21/683
CPCH01L21/6838H01L24/75H01L2224/75304H01L2224/75315H01L2224/75745H01L2924/01005H01L2924/01006H01L2924/01033H01L2924/01078H01L2924/01082Y10T29/49126Y10T29/4913Y10T29/53191H01L21/50
Inventor 盖多·赫吉里罗尔夫·赫韦勒丹尼尔·施内特扎勒
Owner ESEC TRADING