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High frequency emitter and detector packaging scheme for 10GB/S transceiver

A technology of transceivers and transceivers, applied in the coupling of instruments, optical waveguides, optics, etc., can solve problems such as increased measurement

Inactive Publication Date: 2006-08-30
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Additionally, additional measurements must be taken to block external perturbations

Method used

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  • High frequency emitter and detector packaging scheme for 10GB/S transceiver
  • High frequency emitter and detector packaging scheme for 10GB/S transceiver
  • High frequency emitter and detector packaging scheme for 10GB/S transceiver

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Embodiment Construction

[0016] The present invention provides optical subassemblies that can be used in high bandwidth transceivers with an assembly scheme that ensures that alignment between signaling and detection components is optimized and maintained over the lifetime of the device. The assembly scheme includes a pair of polymer optic modules that are used to couple light transmitted to and received from each fiber optic cable. During the pre-alignment process, the head end portions of the polymer optical modules are inserted into respective slots formed in the mounts, which are mounted on the optical subassembly substrate on which the emitters and detectors are mounted. During the subsequent active alignment process, each polymer optical module is positioned relative to its respective emitter or detector until a maximum signal is detected, at which point it is agent to quickly set the position of the component. Optionally, additional adhesive may be used to further secure the components. The r...

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Abstract

An apparatus and packaging scheme that ensures that alignments between signal sending and detecting components in transceivers are optimized and maintained over the lifetime of the apparatus. This is accomplished through use of a pair of polymer optical modules, which are used to couple light sent to and received from respective fiber optic cables. During a pre-alignment process, head portions of the polymer optical modules are inserted into respective slots defined in a standoff that is mounted on an optical sub-assembly to which an emitter and detector are mounted, whereby these slots are configured so that the head portions slide along the sidewalls of the slots during assembly. During a subsequent active alignment process, each polymer optical module is positioned relative to its respective emitter or detector until a maximum signal is detected, whereupon the position of the components is quick-set using a UV-sensitive adhesive. Additional adhesive may then be added to further secure the components.

Description

technical field [0001] The present invention relates generally to very high bandwidth transceivers, and more particularly to an assembly scheme for very high bandwidth transceivers in which a transmitter and a detector are assembled in a single unit. Background technique [0002] Network communications have greatly increased data usage, enabling the sending of increasingly large amounts of data. In order to facilitate meeting the ever-increasing demands on data transmission, communication systems gradually increase their bandwidth. For example, developers of Ethernet technology provide standards for transmission rates of 10Mb / s, 100Mb / s, and 1Gb / s. Recently, standards for 10Gb / s Ethernet are being defined. [0003] Network communication involves the transfer of data between two end devices (eg, computers), typically coupled by one or more intermediate devices. For example, when data is consumed over the Internet, intermediate devices used for the data path (ie, the route ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4226G02B6/423G02B6/4225G02B6/4201G02B6/4246G02B6/4214G02B6/4277G02B6/4279
Inventor A·阿尔杜伊诺D·克拉夫茨S·佩达达B·扎波尔斯基S·弗莱舍尔
Owner INTEL CORP