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Infrared detector packaged with improved antireflection element

An infrared detector and detector technology, applied in the field of thermal imaging, can solve problems such as coating difficulties, performance degradation, and uniformity difficulties

Inactive Publication Date: 2006-12-20
HONEYWELL INT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But when the optical element is a window formed in the cavity, it is very difficult to apply effective anti-reflection elements in the cavity
In addition to degrading performance due to the high temperatures required for many of these coatings, it can be difficult to achieve uniformity on recessed surfaces such as cavities

Method used

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  • Infrared detector packaged with improved antireflection element
  • Infrared detector packaged with improved antireflection element
  • Infrared detector packaged with improved antireflection element

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Embodiment Construction

[0017] figure 1 is an exemplary exploded view of a representative infrared imaging detector 100 in accordance with the present invention. Arrow 110 represents infrared radiation generated by a hot object and sent onto infrared imaging optics 120 of conventional design. The package cover 130 has a window region 131 transparent to infrared wavelengths for transmitting infrared radiation 110 . Hermeticizing and evacuating package 130 is desirable in many applications to improve sensitivity and pixel-to-pixel isolation, and to reduce contamination and degradation.

[0018] The bolometer array 140 within the package lid 130 is fabricated on a substrate of silicon or similar material with suitable electrical and microfabrication properties. (Alternatively, array 140 may be mounted on a separate substrate 141). Individual pixels (eg, 200) are typically arranged in rows and columns of a rectangular matrix, although single rows or other arrangements may also be used. In many applic...

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Abstract

An infrared detector has a window in a cover having a cavity for exposing detector pixels to incident radiation. The window has an antireflective element formed within the cavity as a field of posts. The field of post structures is formed in a cavity by etching the posts in a desired pattern first, and forming the cavity by a general etch over the whole field afterward.

Description

technical field [0001] The present invention relates to thermal imaging and, more particularly, to structures and methods for packaging infrared detector arrays. Background technique [0002] Night vision and related applications can be achieved by receiving infrared radiation emitted by hot objects with an array of uncooled bolometer pixels or other detectors whose electrical output signals can be converted into a visible image. [0003] Uncooled bolometer arrays or similar detectors on semiconductor substrates must be packaged to protect the detector pixels from contamination and degradation. Because the front side of the array must be exposed to incident radiation, many conventional IC packaging techniques are not suitable. [0004] The package lid can be fabricated from an infrared transmissive material such as silicon to provide a window for the detector array. A cavity is micromachined in the cover to seal the cover to the substrate supporting the array. The sealed ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/0203H01L31/0216H01L27/146G01J1/02
CPCH01L27/14618H01L27/1462H01L27/14632G01J5/0875G01J5/045H01L27/14649H01L27/14687H01L2924/0002H01L2924/00H01L31/02
Inventor B·E·科尔
Owner HONEYWELL INT INC