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Copper alloy with high thermal conductivity

A high thermal conductivity, copper alloy technology, applied in the field of alloys, can solve the problem that the thermal conductivity cannot meet the requirements, and achieve the effect of solving the problem of heat dissipation and improving the thermal conductivity

Inactive Publication Date: 2007-02-14
SICHUAN YUTAI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Alloys of other materials, as disclosed on January 29, 2003, the announcement number is CN1393572A, and the alloy material disclosed by the name "a kind of low-expansion and high-thermal-conductivity silicon-aluminum alloy" has a thermal conductivity of 150Wm -1 k -1 can not meet the requirements
At present, pure (purple) copper and silver have the highest thermal conductivity, but they can only reach 388-391Wm of pure (purple) copper -1 k -1 , Silver 416Wm -1 k -1

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0008] In the following, the high thermal conductivity copper alloy of the present invention will be further explained and described in detail in conjunction with the production process flow and specific examples.

[0009] crafting process:

[0010] Using high-purity cathode copper Cu

[0011] High Purity Tellurium Te

[0012] Low Sodium Lithium Li

[0013] Rare earth metal RE

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PUM

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Abstract

The invention discloses a copper alloy with high thermal conductivity, which comprises (by weight ratio) 0.001-0.008% of comprehensive rare-earth metal, 0.01-0.35% of tellurium, 0.001-0.0035% of lithium, and balancing copper.

Description

technical field [0001] The invention relates to an alloy, in particular to a copper alloy with high thermal conductivity. Background technique [0002] Many production devices require heat dissipation. Especially in the field of electronic products, due to the continuous miniaturization of products and the continuous improvement of the integration of electronic components, the heat dissipation of electronic products restricts the development of products. Especially in the field of computer chips, hundreds of millions of transistors are integrated on a chip, and its heat generation is particularly huge. At present, the American company Intel produces the Pentium4 3.2G notebook computer microprocessor, and its power consumption reaches 72 watts, which is equivalent to the power consumption of a 21-inch ordinary color TV set, and the area of ​​the microprocessor is very small, only 9.6 square meters Centimeter, it can be seen how important its heat dissipation is. The curren...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00
Inventor 罗毅
Owner SICHUAN YUTAI TECH