Leadframe for preventing pin from short circuit and method for making semiconductor package having same

Abstract

A lead frame preventing pin from short and a process method for a semiconductor packaging unit with the said lead frame is to form a thickness reducing part at the place that every pin is at the edge of the lead frame to be designed in a cross way between adjacent pins which can greatly increase the pitch between the pin thickness reducing parts to avoid short from bridge resulted by burr extension when cutting adjacent pins.

Description

technical field [0001] The present invention relates to a lead frame and a method for making a semiconductor package with the lead frame, in particular to a lead frame with a quad flat non-lead (QFN) semiconductor package, and a lead frame with the lead frame The manufacturing method of the semiconductor package of the frame. Background technique [0002] The basic structure of a general square planar pinless semiconductor package includes carrying at least one chip on a chip holder of a lead frame, and forming conductive components such as bonding wires for the chip to be electrically connected to the pins surrounding the chip holder Then, the encapsulation resin is used to form the encapsulation compound for encapsulating the chip, the bonding wire and the lead frame. As it is named, this kind of semiconductor package is characterized in that it is not provided with external pins, that is, it is not formed with exposed pins for electrical connection with the outside as in...

AI Technical Summary

Problems solved by technology

[0006] However, the package structure invented by the above-mentioned patent still has the risk of pin bridging phenomenon

In the singulation operation of the package, since the lead frame is made of metal, when cutting the pins, the pins often adhere to the cutting tool due to the metal, resulting in cutting burrs (Burr)

As shown in accompanying drawing 6B and accompanying drawing 7B, because the thickness of pin 14,24 of semiconductor package 1,2 is quite and arranges closely, so easy to cut burr along cutting direction (shown by the arrow in the figure) between adjacent pins ) extension (as shown in the partially enlarged area in the figure), resulting in pin bridging and short circuit (Short), which seriously damages the quality of the order cutting operation and the product yield

[0007] Therefore, how to effectively solve the problem of pin bridging and short circuit caused by the extension of pin cutting burr, so as to ensure the quality and reliability of the package, is a top priority.

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