Correlation of end-of-line data mining with process tool data mining

Abstract

One embodiment of the present invention is a process tool optimization system that includes: (a) a data mining engine that analyzes end-of-line yield data to identify one or more process tools associated with low yield; and (b) in response to output from the analysis, analyzes process tool data from the one or more process tools to identify one or more process tool parameters associated with the low yield.

Description

technical field [0001] One or more embodiments of the invention relate to the correlation of end-of-line data mining with process tool data mining. Background technique [0002] The manufacture of semiconductor devices continues to become more complex as market demands drive increasing circuit densities. For example, a typical manufacturing process starts with a single piece of silicon (referred to herein as a wafer or substrate) and processes it through a series of about 300 to 500 individual manufacturing steps to Many individual devices are fabricated on each wafer. Additionally, as circuit densities increase, line widths will decrease, and newer technologies and materials will be used in semiconductor manufacturing. For example, copper processing technology is moving from 0.18μm technology to 0.13μm technology. In addition, the advent of copper seeds and plating, along with the added difficulty in applying new low-k material films and the requirement to fill 0.13μm st...

AI Technical Summary

Problems solved by technology

As a result, users often spend more time trying to figure out the problem, rather than working on actually repairing and adjusting treatment tools after they have been identified

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