Copper plated material, its manufacturing method and method for copper plating

Abstract

A copper electroplating material using as a copper supply source during preparation. Basic copper carbonate is formed in a reaction tank by deposition and heated to a temperature of between 250 DEG C. and 800 DEG C. in an atmosphere which does not form a reducing atmosphere which does not form a reducing atmosphere, to thereby be subjected to thermal decomposition, resulting in providing easily soluble copper oxide.

Description

technical field [0001] The present invention relates to a material for copper plating (hereinafter referred to as "copper plating material"), a manufacturing method thereof, and a method of copper plating, and more particularly to use as a supply source of copper ions in a copper plating bath for copper plating a workpiece A copper-plated material, a method for manufacturing the copper-plated material, and a copper-plated method using the copper-plated material. Background technique [0002] One of the known techniques for copper-plating an object to be plated (hereinafter referred to as "the piece to be plated") is to put the copper-plated material into a sulfuric acid solution used as an electrolyte, and between an insoluble anode and the piece to be plated as a cathode Copper plating method with current flow. In this method, copper oxide obtained by thermally decomposing basic copper carbonate is used as a copper plating material (see Japanese Patent No. 2,753,855). [...

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Problems solved by technology

However, the update of the electroplating tank leads to a significant increase in the cost of electroplating, which increases the cost of the workpiece to be plated

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