Wire frame, semiconductor device using such frame and its mfg. method

Abstract

A lead frame 10, comprising: a frame portion 11; disposed between the frame portion 11 and an inner inner lead portion 14A, and extending from the frame portion 11 to the inner side, and having a convex portion 14a under the die pad portion 13 a plurality of outer inner lead portions 14B. The inner inner lead portion 14A is insulated from the die pad portion 13 by cutting away the support portion of the die pad portion 13 and the inner inner lead portion 14A. Bottom surfaces of the frame portion 11 , the plurality of inner inner lead portions 14A, and the outer inner lead portions 14B are held by an adhesive tape material 20 as a lead holding material. From a single-layer metal plate, it is relatively easy to obtain a small lead frame with a multi-row boss structure, especially with more than 3 rows of bosses.

Description

Technical field [0001] The present invention relates to a lead frame for a land grid array (LGA) having exposed external terminals arranged in an array on the bottom surface of a package, that is, a plurality of bosses, and a resin-sealed type using the lead frame Semiconductor devices and their manufacturing methods. Background technique [0002] In recent years, in order to adapt to the miniaturization and high functionality of electronic equipment, there has been an increasing demand for high-density mounting of semiconductor components. Along with this trend, the miniaturization and thinning of resin-sealed semiconductor devices that use molded resin materials to seal semiconductor chips and wires as a unit are rapidly developing. While miniaturization and thinning are pursued, multiple pins are more desirable. [0003] Hereinafter, a lead frame used in a conventional resin-sealed semiconductor device will be described with reference to the drawings. [0004] Picture 12 Rep...

AI Technical Summary

Problems solved by technology

[0012] However, since BGA-type or LGA-type semiconductor devices use a laminated multilayer printed circuit board (carrier) made of ceramic materials and resin materials, there is a problem that the manufacturing process is complicated and the cost is extremely high.

[0013] Also, there is the following problem: even if the Figure 12 and Figure 13 The manufacturing method of the conventional resin-sealed type semiconductor device shown is continued to be used as a manufacturing method of BGA type or LGA type semiconductor device, but since it is necessary to provide a connection support portion for connecting a plurality of bosses as external terminals to the frame before processing , and if more than 3 rows of bosses are set, miniaturization becomes impossible

[0014] In addition, in the conventional method of manufacturing a resin-sealed semiconductor device, the accuracy of mounting on a printed circuit board is lower than that of a surface-mounted semiconductor device such as a BGA type or an LGA type.

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