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System for providing package for opening hollow cavity low-profile packaged semiconductor

A cavity and packaging material technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc. Effect

Inactive Publication Date: 2003-09-24
SOCIONEXT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, a conventional fingerprint sensor measures approximately 22 x 12 x .4mm, which is a relatively large package and not suitable for use in portable applications

Method used

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  • System for providing package for opening hollow cavity low-profile packaged semiconductor
  • System for providing package for opening hollow cavity low-profile packaged semiconductor
  • System for providing package for opening hollow cavity low-profile packaged semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The present invention includes a system for wire bonding to a fingerprint sensor die to provide maximum access to the surface of the fingerprint sensor while providing the smallest possible size. The system reduces the height of the wire loop formed by bonding the wires, thereby reducing the base height of the packaging material. Accordingly, various embodiments of systems that incorporate the present invention are discussed in detail below.

[0033] typical embodiment

[0034] image 3 One embodiment of a fingerprint sensor die 300 according to the present invention is shown, wherein the die 300 has leads bonded between die contacts 302 and substrate contacts 304 . The illustrated bond wires 306, 308 have a very low loop height 310 in accordance with the present invention.

[0035] to form image 3In the wire bonding shown, the capillary device 312 is balled at the end of a bond wire 314 and this ball is soldered to one of the substrate contacts 304 . The leads 31...

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PUM

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Abstract

The present invention relates to a system for providing an open cavity low profile package semiconductor package, wherein the system includes a method for wire bonding a fingerprint sensor die to an external circuit. The fingerprint sensor die includes a sensor array having one or more die contacts that are wire bonded to one or more external contacts of an external circuit such that the usable portion of the sensor array is maximized. The method includes the steps of: forming a ball at a first end of a bonding wire; forming a conductive connection between the ball and a selected external contact on an external circuit; extending the bonding wire to the selected die contact to form a wire loop at a low loop height; form a conductive pin spot solder connection between the second end of the bonding wire and the selected die contact; and, repeat the above steps until one or more die contact wires are bonded to One or more external contacts of an external circuit.

Description

technical field [0001] The present invention relates to semiconductor devices, and more particularly to a system for providing a fingerprint sensor with increased sensor accessibility. Background technique [0002] Semiconductor devices are increasingly used as input devices for digital systems. For example, in authentication and security applications, semiconductor devices are used to provide user identification information. One such device is a semiconductor fingerprint sensor. [0003] FIG. 1 shows a portion of a typical semiconductor fingerprint sensor 100 . Typically, such sensors are used as integrated circuits (ICs). Sensor 100 includes a stamp (or wafer) 102 attached to a substrate 104 by an adhesive or epoxy bond 106 . The sensor surface 108 of the stamp 102 has a conductive grid, shown in detail at 110, which is used to form a capacitive circuit for detecting features of a human fingerprint when the sensor surface is touched. This grid is coupled to a pluralit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/117G06K9/00H01L21/60H01L23/28
CPCH01L24/45H01L24/78H01L24/85H01L2224/45124H01L2224/45144H01L2224/48091H01L2224/48225H01L2224/48227H01L2224/48465H01L2224/48471H01L2224/48479H01L2224/73265H01L2224/78301H01L2224/85051H01L2224/85186H01L2224/85986H01L2924/01006H01L2924/01013H01L2924/01015H01L2924/01033H01L2924/01047H01L2924/01079H01L2924/01082H01L2924/01327H01L2924/14H01L2924/1815H01L2924/30105H01L2924/01005H01L2224/85205H01L2224/85207H01L2924/181H01L2224/8592H01L24/48H01L2224/85045H01L2924/00014H01L2224/32225Y10T29/49144Y10T29/49176Y10T29/49179Y10T29/49171Y10T29/49146G06V40/1306H01L2924/00H01L2924/00015H01L2924/00012H01L2224/4554H01L21/60
Inventor 迈克尔·曼纳萨拉
Owner SOCIONEXT INC
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