Method and equipment for quantitatively distributing adhesion agent onto heat radiator fin, and positioning adhesion therefor

Abstract

A method for quantitatively coating adhesive on heat radiator and its locating and adhering includes such steps as sprading several heat radiators on a first locating implement, putting a perforated coating template on the first locating implement, coating, adhesive via the through holes of template, removing the said template, putting a slug in a second locating implement with notch on top wall, and adhering the radiator to the slug via the said notch.

Description

(1) Technical field [0001] The invention relates to a method and a device for quantitatively coating an adhesive and positioning and adhering a heat sink. (2) Background technology [0002] Referring to Figures 1 and 2, a known method of coating the heat sink 1 with the adhesive 2 and sticking it is to take out a heat sink 1 at a time during each action, and prepare it to be connected with a circuit board 3 When the chip 31 is in contact with an adhesive surface 10, apply a layer of adhesive 2 manually, and then take out a piece of circuit board 3, and align the adhesive surface 10 of the heat sink 1 with the adhesive 2 to the circuit. The chip 31 of the board 3 is pasted with force, and finally the angle and position of the heat sink 1 pasted are slightly adjusted, and this process is completed. [0003] This method of coating the heat sink 1 with the adhesive 2 and pasting it on the chip 31 of the circuit board 3 has the biggest disadvantages of the slow speed of the bond...

AI Technical Summary

Problems solved by technology

[0003] This method of coating the heat sink 1 with the adhesive 2 and pasting it on the chip 31 of the circuit board 3 has the biggest disadvantages of the slow speed of the bonding process and the difficulty in controlling the amount of adhesive 2 applied, and it is pasted on the chip 31. The relative position and angle on the chip 31 of the circuit board 3 are different for each piece, because it is coated and pasted manually by the operator, so there will be many uncertain factors affecting the production process during the operation process. These factors are as follows: Differences in the proficiency of the operators, the mental state of the operators themselves, the working environment or operating equipment, etc., can easily occur if there is too much adhesive 2, causing the adhesive 2 to overflow to the surface of the circuit board 3 during pasting. On the surface, pollution and damage to the appearance of the circuit board 3, or too little adhesive 2 leads to insufficient adhesion between it and the chip 31, or problems such as angle skew and position shift of the heat sink 1 during adhesion, these problems occur during production Any defect may cause the circuit board 3 to be returned in batches during the quality control inspection

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