Method and equipment for quantitatively distributing adhesion agent onto heat radiator fin, and positioning adhesion therefor

A heat sink and adhesive technology, which is applied in the direction of surface coating liquid devices, coatings, electrical components, etc., can solve the problem of difficult control of the amount of adhesive 2 coating, skewed angle of heat sink 1, position shift, etc. question

Inactive Publication Date: 2003-12-03
MITAC INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] This method of coating the heat sink 1 with the adhesive 2 and pasting it on the chip 31 of the circuit board 3 has the biggest disadvantages of the slow speed of the bonding process and the difficulty in controlling the amount of adhesive 2 applied, and it is pasted on the chip 31. The relative position and angle on the chip 31 of the circuit board 3 are different for each piece, because it is coated and pasted manually by the operator, so there will be many uncertain factors affecting the production process during the operation process. These factors are as follows: Differences in the proficiency of the operators,

Method used

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  • Method and equipment for quantitatively distributing adhesion agent onto heat radiator fin, and positioning adhesion therefor
  • Method and equipment for quantitatively distributing adhesion agent onto heat radiator fin, and positioning adhesion therefor
  • Method and equipment for quantitatively distributing adhesion agent onto heat radiator fin, and positioning adhesion therefor

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Embodiment Construction

[0019] refer to image 3 , 4 , 5 and 6, the method of quantitatively coating the heat sink 1 with the adhesive 2 and positioning and pasting it on the chip 31 of the circuit board 3 in a preferred embodiment of the present invention includes the following steps:

[0020] Step (1) is to place a plurality of cooling fins 1 with an adhesive surface 10 facing upwards, and arrange them in a tiled manner in a plurality of accommodating spaces 44 of a first positioning tool 4 . The first positioning tool 4 is in the shape of a rectangular plate with a top plane 43, and the accommodating space 44 is formed by recessing downwards on the top plane 43, and the size of each accommodating space 44 is the same as The shape and thickness of the heat sink 1 correspond to accommodate the heat sink 1. In this embodiment, after the heat sink 1 is placed in the accommodating space 44, its adhesive surface 10 is flush with the top plane 43, and A receiving slot 42 is provided between adjacent rec...

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Abstract

A method for quantitatively coating adhesive on heat radiator and its locating and adhering includes such steps as sprading several heat radiators on a first locating implement, putting a perforated coating template on the first locating implement, coating, adhesive via the through holes of template, removing the said template, putting a slug in a second locating implement with notch on top wall, and adhering the radiator to the slug via the said notch.

Description

(1) Technical field [0001] The invention relates to a method and a device for quantitatively coating an adhesive and positioning and adhering a heat sink. (2) Background technology [0002] Referring to Figures 1 and 2, a known method of coating the heat sink 1 with the adhesive 2 and sticking it is to take out a heat sink 1 at a time during each action, and prepare it to be connected with a circuit board 3 When the chip 31 is in contact with an adhesive surface 10, apply a layer of adhesive 2 manually, and then take out a piece of circuit board 3, and align the adhesive surface 10 of the heat sink 1 with the adhesive 2 to the circuit. The chip 31 of the board 3 is pasted with force, and finally the angle and position of the heat sink 1 pasted are slightly adjusted, and this process is completed. [0003] This method of coating the heat sink 1 with the adhesive 2 and pasting it on the chip 31 of the circuit board 3 has the biggest disadvantages of the slow speed of the bond...

Claims

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Application Information

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IPC IPC(8): B05D1/26B05D5/10B05D7/24H01L23/36
Inventor 李肇基
Owner MITAC INT CORP
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