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Method for packaging CPU module for intelligent card with UV glue sticking chip

A CPU module and smart card technology, applied in the recording medium, instruments, electrical components and other directions used by machines, can solve the problems of low binding force between colloid and tape base material, difficult control of packaging height, low protection effect, etc., to achieve good protection, The effect of improving the pass rate and improving the reliability

Inactive Publication Date: 2003-12-17
SHANGHAI CHANGFENG SMART CARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are two commonly used packaging technologies for smart card CPU modules: UV glue packaging and black glue packaging technology. The former commonly used method is to only have fillers without damming, that is, use 4670UV glue on the chip, The gold wire is coated, the UV glue is the highest in the middle, and gradually extends to the surroundings. When encountering CPU chips with a single side > 3.2mm, large storage capacity, and high frequency of use, the protection effect of this package on the chip and gold wire is lower than that of the package of the present invention. method
Compared with UV glue packaging, the latter black glue packaging has the disadvantages of difficulty in controlling the height of the packaging and low bonding force between the glue and the tape base material, so it is usually not used.

Method used

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  • Method for packaging CPU module for intelligent card with UV glue sticking chip
  • Method for packaging CPU module for intelligent card with UV glue sticking chip
  • Method for packaging CPU module for intelligent card with UV glue sticking chip

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0023] Such as figure 1 As shown, the following steps are taken when packaging the CPU:

[0024] Step 1, such as figure 2 and image 3 As shown, according to the cavity size of different strips, use 4696 glue to form a rectangular dam around the chip to be packaged (generally between 7.2×7.4-9.3×9.5), and all solder joints must be surrounded. into it.

[0025] Step 2. According to the size of the dam to be filled, use 4670 glue to seal all the chips and gold wires in the dam.

[0026] Step 3, UV curing The packaged module is irradiated with UV ultraviolet rays in a UV curing furnace, and the curing time is about 60 seconds.

[0027] Step 4. Thickness measurement After the cured modules come out of the curing furnace, a thickness gauge is used to measure the thickness of all the modules. The thickness of the modules is between 0.46-0.58mm for quali...

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Abstract

A method for packaging the CPU module used for intelligent card includes such steps as sticking chip onto its carrier, welding gold wires, coating a turn of UV resin to surround the chip, filling the UV resin until the chip and gold wires are buried in it, irradiating by UV light, and solidifying. Its advantages are high packaging quality and high power to bear pressure and torsional force.

Description

technical field [0001] The invention relates to a smart card manufacturing technology, in particular to a method for building and packaging a CPU module for a smart card with ultraviolet (UV) glue. Background technique [0002] Compared with memory chips, CPU chips have larger area, higher integration, larger storage capacity, and higher cost, so they have higher requirements for circuit packaging. There are two commonly used packaging technologies for smart card CPU modules: UV glue packaging and black glue packaging technology. The former commonly used method is to only have fillers without damming, that is, use 4670UV glue on the chip, The gold wire is coated, the UV glue is the highest in the middle, and gradually extends to the surroundings. When encountering CPU chips with a single side > 3.2mm, large storage capacity, and high frequency of use, the protection effect of this package on the chip and gold wire is lower than that of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07H01L21/50
CPCH01L2224/49171
Inventor 叶柏海丁富强
Owner SHANGHAI CHANGFENG SMART CARD