Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Pod load interface equipment adapted for implementation in a fims system

A technology of interface and interface machinery, which is applied in the field of front-opening interface mechanical standard system equipment, can solve problems such as large tolerances and affecting equipment accuracy

Inactive Publication Date: 2003-12-31
NEWPORT CORP
View PDF3 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Boxes, made of plastic, with alignment features positioned opposite each other, oversized or undersized, i.e. large tolerances may affect the accuracy of the positioning of the equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pod load interface equipment adapted for implementation in a fims system
  • Pod load interface equipment adapted for implementation in a fims system
  • Pod load interface equipment adapted for implementation in a fims system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0055] figure 1 with figure 2 A wafer transfer system 10 is shown having one mounting frame 12 with two front shields or channel plates 14 attached to the mounting frame 12 . Each front cover 14 supports a substantially identical packing interface system 16 for receiving a front-opening semiconductor wafer transfer case 18. Linear motion robot 20 for wafers in bin 18 . Interface system 16 with shelves 22 on the right side is shown with a sliding tray 24 supporting transfer box 18; parts.

[0056] Figure 3A to Figure 3G Several views of transfer box 18 and its components are shown.

[0057] Figure 3A shows the transfer box 18 with the door 30 removed, and the wafer cassette 32 inside the transfer box 18 can be seen, which accommodates 300 mm diameter semiconductor wafers through spaced slots. The transfer box 18 has a stepped concave border 34 against which the perimeter of the inner surface 36 of the door 30 abuts when the transfer box 18 is closed.

[0058] Figure ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

One or more mounting registration points provide alignment between a FIMS system and a specimen handling system that delivers a specimen retrieved from a specimen transport box. The specimen handling system includes one or more mounting points, each cooperating with an alignment fixture to immovably secure the specimen handling system to the FIMS system at a corresponding mounting registration point. This mounting technique provides automatic alignment of the specimen handling system to each mounting registration point of the FIMS system.

Description

[0001] related application [0002] This application is a continuation of 09 / 352,155 (filed July 12, 1999, claiming the benefits of provisional application 60 / 092,626, filed July 13, 1998). technical field [0003] The present invention relates to front opening interface machinery standard (FIMS) system equipment, and more particularly to a device that facilitates proper alignment and transfer of contained specimens when transporting specimens between small environments and self-contained sealed specimen transport systems. FIMS transfer case loading interface for accurate and reliable positioning of the case. Background technique [0004] The system equipped with FIMS can transport semiconductor wafers in and out of the clean room by connecting a clean semiconductor wafer box transfer box, and send the semiconductor wafers to the clean environment established for semiconductor processing equipment or other clean environments. The system must be equipped with a door on the f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01J65/00B65G49/07H01J61/35H01J65/04H01L21/20H01L21/336H01L21/67H01L21/673H01L21/677H01L21/84H01L29/786
CPCH01L29/78675H01L21/2026H01J65/046H01L21/67775H01L21/67373H01L21/67772H01L29/66772H01J61/35H01L29/78654H01L21/67379H01L29/66757H01L27/1296H01L27/1274H01L21/68
Inventor P·巴克奇P·S·菲利普斯基
Owner NEWPORT CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com