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Photosensitive film for circuit formation and process for producing printed wiring board

A photosensitive film and circuit technology, which is applied in the fields of printed circuit manufacturing, photosensitive materials used in optomechanical equipment, and removal of conductive materials by chemical/electrolytic methods. Vacuum takes time and other issues

Inactive Publication Date: 2004-05-26
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] This method is expensive and takes time to evacuate, so it is rarely used in the usual circuit formation.

Method used

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  • Photosensitive film for circuit formation and process for producing printed wiring board
  • Photosensitive film for circuit formation and process for producing printed wiring board
  • Photosensitive film for circuit formation and process for producing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8

[0096] (Examples 1-8 and Comparative Examples 1-6)

[0097] [Production of photosensitive layer material]

[0098] According to the material ratio shown in Table 1, a solution of the photosensitive layer material (I) was prepared.

[0099] project

Material

Proportion

(A) Ingredients

Methacrylic acid / methyl methacrylate / styrene (weight ratio:

20 / 60 / 20, weight average molecular weight 60,000) 40% by weight of a copolymer

Base cellosolve / toluene (weight ratio 60 / 40) solution

137.5 parts by weight

(solid content: 55

parts by weight)

(B) Ingredients

2,2'-bis((4-methacryloylpentaethoxy)phenyl)propane

30 parts by weight

γ-Chloro-β-hydroxypropyl-β’-methacryloylethylphthalene

Ester

15 parts by weight

(C) Ingredients

2-(o-chlorophenyl)4,5-diphenylimidazole dimer

3.0 parts by weight

4,4'-Bisdiethylaminobenzophenone

0.2 parts by weight

Reagent

colorless crystal violet ...

Embodiment 1

[0104] [Production of photosensitive film for circuit formation (1)]

[0105] The first film uses a polyethylene terephthalate film (trade name: G2-16, manufactured by Teijin Co., Ltd.) with a thickness of 16 μm, and the solution of the photosensitive material (I) is evenly coated thereon to make the thickness after drying When it reaches 4 μm, dry it with a hot air convection dryer at 100°C for 10 minutes. Then, a 20 μm thick biaxially stretched polypropylene film (trade name: E-200H, manufactured by Oji Paper Co., Ltd.) was used as a second film protection to obtain a photosensitive film (1) for circuit formation. The obtained photosensitive film (1) for circuit formation was wound up so that the 1st film might be located outside.

Embodiment 2

[0107] [Production of photosensitive film for circuit formation (2)]

[0108] The photosensitive film (2) for circuit formation was produced similarly to Example 1 except having made the film thickness after drying of the photosensitive layer in Example 1 into 6 micrometers. The obtained photosensitive film (2) for circuit formation was wound up so that the 1st film might be located outside.

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Abstract

The photosensitive film for circuit formation of the present invention has: on a first film (base film), a photosensitive layer having a thickness of 0.1 to 10 mum; or a photosensitive layer having a thickness of 0.1 to 14 mum and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.

Description

technical field [0001] This invention relates to the manufacturing method of the photosensitive film for circuit formation, and a printed wiring board. Background technique [0002] When manufacturing a printed wiring board, a photosensitive film for circuit formation is used to form a photoresist film for plating or etching. This film is formed by coating a photosensitive resin composition on a first film (base film) and drying it to form a photosensitive layer, and then laminating a second film (protective film) on the photosensitive layer. Furthermore, in the past, the first layer film and the photosensitive layer were used as a transfer layer and laminated on the substrate of the printed wiring board to be laminated. [0003] When laminating such a conventional photosensitive film for circuit formation, the transfer layer is placed on the substrate with the photosensitive layer facing the substrate side after peeling off the second film. Then, the transfer layer, that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/09G03F7/11
CPCG03F7/092G03F7/027G03F7/11
Inventor 久保田雅夫大桥武志市川立也
Owner RESONAC CORPORATION