SiC/Cu composite materrial and preparation material

Abstract

A SIC / Cu composite material is composed of SiC grains and Cu materials in which, SiC grains account for 50-75vol%, Cu material makes up of 25-50vol%. The invented preparation method includes: 1. filling, filling SiC grains into the cavity of a mold to be pressed into a frabricated block, 2. pre-heating: pre-heating the mold containing SiC grains to 900deg.C-1100deg.C and heating the Cu to be smelted 3. carting the melted Cu into the mold, 4. pressing and immersing: applying pressure by a press to immerse the Cu melt into the slots among SiC grains, 5. keeping pressure and cooling down 6. stripping and taking out the ingot.

Description

Technical field:

[0001] The invention relates to a high-density, low-cost SiC / Cu composite material and a preparation process thereof. Background technique:

[0002] Electronic packaging materials require high thermal conductivity and low expansion properties. Traditional electronic packaging materials are mainly ceramics and metals. The ceramic material Al 2 o 3 Although the thermal expansion coefficients of AlN, BeO, etc. are low, their thermal conductivity is poor, while metal materials such as Cu and Al have good thermal conductivity, but their thermal expansion coefficients are high, and it is difficult to meet the requirements of high thermal conductivity and low expansion at the same time. The coefficient of thermal expansion of typical SiC particles is 3.4×10 -6 / °C, the modulus of elasticity is 450GPa, and the density is as low as 3.2G / cm 3 , while the thermal conductivity of copper is as high as 397W / (m·℃), and the thermal expansion coefficient is only 17.7×10...

Images