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Redix composition

A technology of epoxy resin and composition, which is applied in the field of green and environment-friendly epoxy resin composition, can solve problems such as high viscosity of epoxy resin composition, difficulty in meeting fluidity process performance, difficulty in meeting reliability requirements, etc., and achieve good Resistant to heat solder and thermal cycles, meeting high temperature reliability requirements, effect of low water absorption

Inactive Publication Date: 2005-02-23
HENKEL HUAWEI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, halogenated flame retardants will be gradually replaced, and now there are not many phosphorus-containing flame retardants and metal hydroxide flame retardants. Although halogens and antimony are removed, the epoxy resin composition must be If you want to meet the UL-94V-0 flame retardant standard, you need to add a large amount, so that the viscosity of the epoxy resin composition is relatively high, and the fluidity and process performance are difficult to meet the requirements of electronic packaging, especially It is difficult to meet the reliability requirements of high-temperature reflow soldering of the green and environmentally friendly lead-free solder process

Method used

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  • Redix composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1. A kind of epoxy resin composition, it comprises epoxy resin, curing agent phenolic resin, curing accelerator, composite inorganic filler, release agent, coupling agent and colorant, and described epoxy resin is that general formula is (I ) and a mixture of epoxy resins of general formula (II),

[0019]

[0020]

[0021] Wherein, n is an integer of 0-100.

Embodiment 2

[0022] Example 2. In the epoxy resin composition described in Example 1, the epoxy resin of general formula (II) accounts for 20% of the total amount of epoxy resin.

Embodiment 3

[0023] Example 3. In the epoxy resin composition described in Example 1, the epoxy resin of general formula (II) accounts for 1% of the total amount of epoxy resin.

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PUM

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Abstract

A kind of epoxy resin makes things up, it includes epoxy resin, solidification pharmaceutical phenol aldehyde and resin, solidification promoter, the packing of inorganic that compound, the pharmaceutical of drawing of patterns, unite pharmaceutical and colouring agent occasionally, characteristic its lie in stated epoxy resin general formula (I) and mixture of epoxy resin on general formula. It is that a kind of green epoxy resin makes things up that this invention epoxy resin makes things up, it can not merely reach the fire-retardant standard of UL-94V-0 grade, accord with and meet getting green environmental protection make to have antimony and can meet unleaded craft high-temperature request of dependability thing up to epoxy resin too, it is a kind of outstanding semiconductor encapsulation that makes things up with the epoxy resin. Suitable for green encapsulation semiconductor device and integrated circuit.

Description

technical field [0001] The invention relates to an epoxy resin composition for semiconductor encapsulation, in particular to a green and environment-friendly epoxy resin composition. Background technique [0002] As an electronic packaging material, the flame retardancy of the epoxy resin composition must meet the quality standard of UL-94V-0 flame retardancy. In the prior art, the main method to achieve this quality standard is to add a certain amount of flame retardants. There are many types of flame retardants currently used, but mainly halogenated flame retardants, phosphorus-containing flame retardants, metal hydrogen Oxide-based flame retardants, etc., halogen-based flame retardants are the mainstream. With the strengthening of global environmental protection awareness, countries have drafted environmental protection bills to restrict the use of halogenated flame retardants and lead-containing and other harmful substances in electronic produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/34C08L63/00
Inventor 成兴明韩江龙李兰侠谢广超单玉来张立忠孙波李云芝
Owner HENKEL HUAWEI ELECTRONICS