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Halogen-free fire-retarding epoxy resin composition

A technology of epoxy resin and composition, which is applied in the direction of electrical components, circuits, electric solid devices, etc., can solve the problems of toxic and harmful gases, unfavorable human environment, etc., and achieve high thermal conductivity, low viscosity, and high temperature reliability. Effect

Inactive Publication Date: 2011-02-09
JIANGSU ZHONGPENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, halogen flame retardants will produce toxic and harmful gases during the combustion process, which is harmful to the human body and the environment.

Method used

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  • Halogen-free fire-retarding epoxy resin composition
  • Halogen-free fire-retarding epoxy resin composition
  • Halogen-free fire-retarding epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Example 1. A halogen-free flame-retardant epoxy resin composition, which is composed of the following raw materials in weight ratio,

[0028] epoxy resin 5;

[0029] Phenolic resin 5;

[0030] Inorganic filler 50;

[0031] Hydroxide flame retardant 0.1;

[0032] Curing accelerator 0.5;

[0033] Silane coupling agent 0.5;

[0034] Colorant 0.1;

[0035] Release agent 0.1;

[0036] Described epoxy resin is the epoxy resin of structural formula (I):

[0037]

[0038] Described phenolic resin refers to the phenolic resin that general formula is (II):

[0039]

[0040] Wherein: n=1-10.

Embodiment 2

[0041] Example 2. A halogen-free flame-retardant epoxy resin composition, which is composed of the following raw materials in weight ratio,

[0042] epoxy resin 30;

[0043] Phenolic resin 20;

[0044] Inorganic filler 300;

[0045] Hydroxide flame retardant 10;

[0046] curing accelerator 2.5;

[0047] Silane coupling agent 4.5;

[0048] Colorant 5;

[0049] Release agent 4.5;

[0050] Described epoxy resin and phenolic resin are identical with embodiment 1.

Embodiment 3

[0051] Example 3. A halogen-free flame-retardant epoxy resin composition, which is composed of the following raw materials in weight ratio,

[0052] epoxy resin 20;

[0053] Phenolic resin 15;

[0054] Inorganic filler 200;

[0055] Hydroxide flame retardant 5;

[0056] curing accelerator 1;

[0057] Silane coupling agent 1;

[0058] Colorant 1;

[0059] Release agent 1;

[0060] Described epoxy resin and phenolic resin are identical with embodiment 1.

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Abstract

The invention discloses a halogen-free fire-retarding epoxy resin composition, which is characterized by being prepared from the following raw materials in part by weight: 5 to 30 parts of epoxy resin, 5 to 20 parts of phenolic resin, 5 to 300 parts of inorganic filler, 0.1 to 10 parts of hydroxide fire retardant, 0.5 to 2.5 parts of curing accelerator, 0.5 to 4.5 parts of silicane coupling agent, 0.1 to 5 parts of coloring agent and 0.1 to 4.5 parts of mould release agent. The epoxy resin has a structural formula (I), and the phenolic resin has a general formula (ii). The epoxy resin composition does not contain the conventional fire retardant; the fire retarding performance of the epoxy resin composition meets UL-94V-0 fire retarding standards; the epoxy resin composition meets the halogen-free and stibium-free requirements of environment protection on epoxy resin compositions and requirements on high-temperature reliability of lead-free process; and the epoxy resin composition has low viscosity, low expansion coefficient and high heat conductivity and is suitable for environmentally-friendly semiconductors and integrated circuits.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a halogen-free flame-retardant epoxy resin composition. Background technique [0002] In 2003, the WEEE and RoHS regulations issued by the European Union stipulated that the use of six hazardous materials in discarded electrical or electronic equipment will be banned within a limited period. Japan implements stricter SONY standards. Electronic Information Product Pollution Control Management Measures, the green environmental protection requirements of electronic products have become an irreversible trend. With the improvement of people's environmental protection awareness, electronic waste has also begun to attract attention. Epoxy molding compounds as electronic packaging materials become an irreversible trend. Since the epoxy molding compound contains organic polymer compounds such as epoxy resin, these compounds are easy to burn, so the epoxy molding compound without flame retard...

Claims

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Application Information

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IPC IPC(8): H01L23/29C08L63/00C08K3/02C08G59/62C08K3/22C08K13/02
Inventor 封其立张德伟孙波周佃香吕秀波
Owner JIANGSU ZHONGPENG NEW MATERIAL