Shower head, device and method for manufacturing thin films

Abstract

The invention provides a thin film production apparatus and a production method excellent in productivity and mass-productivity which enable continuous film deposition to stably be performed over a long period causing the reduced number of particles while providing a shower head in which temperature can be controlled in accordance with film deposition conditions and reproducing satisfactory film deposition distribution, compositional distribution and film deposition rate. A shower head structure is incorporated into the upper cover of a film deposition tank, and the upper cover is provided with a heat exchanging means to control the temperature of the upper cover, so that heat exchange is performed at the contact face between a shower plate composing the surface of the shower head and the upper cover, and the temperature of the shower head is made controllable in accordance with film deposition conditions. In the thin film production apparatus, the film deposition tank is provided with the shower head, and a thin film is produced using the apparatus.

Description

technical field [0001] The present invention relates to a spray head, a thin film manufacturing device and a manufacturing method. Background technique [0002] In the case of conventional thin film production equipment, in the case of a device with a substrate table lifting mechanism, due to the gap of the lifting mechanism, the substrate table is pulled into the vacuum when it is in vacuum, and the exhaust gas of the concentric circles is adjusted when it is in the atmosphere. The balance of the port (exhaust path) is broken. Therefore, in order to achieve a uniform film thickness distribution on the substrate, if the film thickness distribution is within ±3%, an exhaust port of 5 mm or more on one side, and if it is within ±2%, an exhaust port of 10 mm or more is necessary (for example, refer to Patent Document 1.). In addition, in an apparatus having this substrate stage elevating mechanism, in order to raise the substrate stage from the substrate transfer position to ...

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Problems solved by technology

[0010] The above-mentioned conventional devices do not take special consideration of turbulent flow, convection, and heat convection with respect to the gas flow, and there are situations where film peeling and particle generation are likely to occur during film formation.

[0011] As mentioned above, when cleaning the film formed on the inner wall of the film-forming tank, etc., in the case that the film cannot be effectively removed in the reaction treatment generated by plasma or chemical gas, the worker must use nitric acid or the like. Chemicals for direct removal are dangerous

Or, as another cleaning method, the film formation tank is removed and sent to a cleaning manufacturer, so there may be a large-scale work of cleaning

Therefore, it can be said that such a thin film manufacturing device is not practical as a mass production device on the premise that it can be used safely and effectively.

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