Assembling apparatus, assembling method and terminal cleaning apparatus

一种组装设备、清洁设备的技术，应用在清洁方法和用具、化学仪器和方法、用电元件组装印刷电路等方向，能够解决基板无法被送入、难以提高清洁步骤工作效率、妨碍缩短组装操作时间周期等问题，达到工作效率缩短的效果

Active Publication Date: 2005-03-30
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, unless one substrate has been cleaned and removed from the apparatus, subsequent substrates cannot be brought in, and it is difficult to improve the work efficiency of the cleaning step, which constitutes a factor that prevents shortening the cycle time of the assembly operation.

Method used

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  • Assembling apparatus, assembling method and terminal cleaning apparatus
  • Assembling apparatus, assembling method and terminal cleaning apparatus
  • Assembling apparatus, assembling method and terminal cleaning apparatus

Examples

Experimental program
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Embodiment Construction

[0021] Embodiments of the present invention will be described below with reference to the accompanying drawings.

[0022] First, refer to figure 1 The overall configuration of an assembly apparatus for crimping electronic parts onto glass substrates in a display panel assembly operation will be described. exist figure 1 In, the assembly equipment passes from the upstream side ( figure 1 The left side of the board) is composed of a substrate supply part 1, a terminal cleaning device 2, an electronic component crimping device 3, and a substrate recovery part 4 in sequence. According to this display panel assembling operation, a glass substrate 5 constituting the main body of the display panel (hereinafter simply referred to as "substrate") is taken out from the substrate supply section 1, and the outer parts provided at the edge portion of the substrate 5 are cleaned using the terminal cleaning device 2. The connection terminal is cleaned, and thereafter, an electronic part i...

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PUM

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Abstract

A terminal cleaning apparatus integrated to an assembling apparatus for integrating a display panel by bonding an electronic part to an externally connecting terminal of a substrate in which substrates 5 respectively held by a first substrate holding portion 24 and a second substrate holding portion 25 moved by an XY table mechanism 23 are made to pass through a first cleaning portion 21 and a second cleaning portion 22 having different cleaning means to simultaneously clean and the substrate which is not cleaned is carried in and the substrate 5 is transferred between the substrate holding portions and the substrate 5 which has been cleaned is carried out simultaneously by a first substrate transferring mechanism 26. Thereby, an operational efficiency of a step of cleaning an externally connecting terminal can be improved by making substrate carrying operation efficient.

Description

technical field [0001] The present invention relates to an assembly device and an assembly method for crimping and bonding electronic components onto a substrate of a liquid crystal display panel, and a terminal cleaning method for cleaning external connection terminals of the substrate equipment. Background technique [0002] In assembly equipment for integrating display panels by crimping electronic parts onto a glass substrate, external connection terminals formed at edge portions of the substrate are crimped with electronic parts in semiconductor chips, flexible substrates, or the like . A method using an adhesive tape formed of an anisotropic conductive material or the like is used for the crimping operation. During crimping, in order to enhance the adhesive performance of the adhesive tape, cleaning must be performed to remove impurities adhered to the surface of the external connection terminal. [0003] Therefore, there is a display panel assembling device which h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13B08B7/00G02F1/1333H05K3/32H05K3/34H05K3/36H05K13/00
CPCH05K3/3489H05K2203/0285H05K2203/095H05K3/361H05K13/0061H05K3/323Y10T29/4913Y10T29/53174Y10T156/14G02F1/13
Inventor 高田秀彦岩川幸喜
Owner PANASONIC CORP
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