Wafer-level electronic modules with integral connector contacts and methods of fabricating the same

Abstract

An electronic module comprising a monolithic microelectronic substrate including at least one integrated circuit die, eg, a plurality of undivided memory dies or a hybrid of different types of integrated circuit dies. The monolithic substrate also includes a redistribution structure disposed on at least one integrated circuit die and providing connector contacts coupled to the at least one integrated circuit die. For example, the connector contact may be configured in the form of an edge connector contact for the module. The redistribution structure may be configured in the form of a passive electronic device providing electrical connection to the at least one integrated circuit die, and / or the redistribution structure may include at least one A conductive layer in the form of an electrical connection is realized by a contact pad of an electronic device, wherein the passive device may be, for example, an inductor, a capacitor and / or a resistor. A method of manufacturing the electronic module is also discussed.

Description

technical field [0001] The present invention relates to an electronic module, and more specifically, to a wafer-level module and a manufacturing method thereof. Background technique [0002] A typical conventional electronic module, such as a memory module, may include multiple packaged integrated circuit devices mounted on a printed circuit board (PCB). These integrated circuit devices can be packaged in a variety of different form factors, including traditional thru-hole packaging and surface mount packaging that facilitate hand and / or wave soldering techniques, as well as chip-scale packaging (CSP ) and wafer-level chip-scale packaging (WLCSP) designed for bonding to PCBs using solder bead technology. [0003] figure 1 A conventional module with a WLCSP device 50 mounted on a PCB 10 is shown. Although not shown in the drawings, the PCB 10 includes circuit traces interconnecting the devices 50 and passive devices 70 such as inductors, capacitors and resistors. The PCB ...

AI Technical Summary

Problems solved by technology

[0005] Conventional device packaging and wiring technologies appear to be approaching minimum form factor limits that limit designers' ability to further reduce module size

Also, techniques that use soldered connections can have reliability and environmental concerns

For example, just figure 1 and 2 For the module shown in , the mechanical shear stress induced on the solder bead by the thermal expansion coefficient mismatch of the device 50 and the PCB 10 may cause the solder joint to fracture

Additionally, the lead content in conventional solders creates environmental concerns

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